SCHEMBL890401

SCHEMBL890401

CC(F)(OC(C)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL580213 0.90 LMNA (0.33)
SCHEMBL22471718 0.87 LMNA (0.38)
SCHEMBL15299974 0.87 LMNA (0.38)
SCHEMBL7679836 0.77 ALDH1A1 (0.33)
SCHEMBL18116699 0.73
SCHEMBL11501540 0.71 TSHR (0.33)
SCHEMBL8676322 0.71
SCHEMBL12603950 0.71
SCHEMBL1029486 0.69 ALDH1A1 (0.33)
SCHEMBL16343844 0.69 KDM4E (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11817310-B2 Bevel portion treatment agent composition and method of manufacturing wafer CENTRAL GLASS COMPANY, LIMITED (JP) 2023-11-14 US disclosed
CN-111699546-B Water-repellent protective film forming agent and chemical solution for forming water-repellent protective film 中央硝子株式会社 2023-09-12 CN disclosed
CN-116710597-A Wet etching solution and wet etching method 中央硝子株式会社 2023-09-05 CN disclosed
CN-116685715-A Substrate, selective film deposition method, deposited film of organic substance, and organic substance 中央硝子株式会社 2023-09-01 CN disclosed
WO-2023157441-A1 ETCHING METHOD 株式会社レゾナック 2023-08-24 WO disclosed
CN-113272471-B Substrate, selective film deposition method, deposited film of organic substance, and organic substance 中央硝子株式会社 2023-07-18 CN disclosed
CN-116324036-A Wet etching method 中央硝子株式会社 2023-06-23 CN disclosed
US-20220020582-A1 BEVEL PORTION TREATMENT AGENT COMPOSITION AND METHOD OF MANUFACTURING WAFER CENTRAL GLASS COMPANY, LIMITED (JP) 2022-01-20 US disclosed
CN-113169060-A Chamfer treatment agent composition and method for producing wafer 中央硝子株式会社 2021-07-23 CN disclosed
US-20210171810-A1 Two Step Adhesive System HENKEL AG & CO. KGAA (DE) 2021-06-10 US disclosed
US-20120080131-A1 HEAT-EXPANDABLE MICROSPHERES AND HOLLOW FINE PARTICLES AND METHOD FOR PRODUCING THE SAME AS WELL AS TIRE/RIM ASSEMBLY MATSUMOTO YUSHI-SEIYAKU CO., LTD. (JP) 2012-04-05 US disclosed
US-20100180995-A1 HEAT-EXPANDABLE MICROSPHERES AND HOLLOW FINE PARTICLES AND METHOD FOR PRODUCING THE SAME AS WELL AS TIRE/RIM ASSEMBLY BRIDGESTONE CORPORATION (JP) 2010-07-22 US disclosed
US-20090078355-A1 TIRE/RIM ASSEMBLY AND HOLLOW PARTICLES BRIDGESTONE CORPORATION (JP) 2009-03-26 US disclosed
EP-1952880-A1 THERMAL EXPANSION MICROSPHERES AND HOLLOW FINE PARTICLES, PROCESS FOR PRODUCING THEM, AND ASSEMBLY OF TIRE AND RIM Bridgestone Corporation (JP) 2008-08-06 EP disclosed
US-7309684-B2 Oil-in-water emulsified remover comprising an ethoxylated alcohol surfactant THE LUBRIZOL CORPORATION (US) 2007-12-18 US disclosed
US-7176174-B2 Reduced volatile organic solvent emissions; removing nonaqueous coatings, waxes, greases THE LUBRIZOL CORPORATION (US) 2007-02-13 US disclosed
WO-2006124445-A2 OIL-IN-WATER EMULSIFIED REMOVER THE LUBRIZOL CORPORATION (US) 2006-11-23 WO disclosed
US-20060258555-A1 Oil-in-water emulsified remover THE LUBRIZOL CORPORATION 2006-11-16 US disclosed
WO-2004081124-A2 WATER-IN-OIL EMULSION THE LUBRIZOL CORPORATION (US) 2004-09-23 WO disclosed
US-20040176263-A1 Reduced volatile organic solvent emissions; removing nonaqueous coatings, waxes, greases LUBRIZOL CORPORATION, THE 2004-09-09 US disclosed