SCHEMBL8907729

SCHEMBL8907729

Nc1ccc(-c2c(N=C=O)cc(N)cc2[N+](=O)[O-])c(N=C=O)c1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.45
TDP1 Q9NUW8 4/20 0.45
CYP3A4 P08684 2/20 0.45
ALOX15 P16050 2/20 0.45
TSHR P16473 3/20 0.43
MAPK1 P28482 2/20 0.43
RECQL P46063 1/20 0.43
HSD17B10 Q99714 1/20 0.43
L3MBTL1 Q9Y468 1/20 0.43
MAPT P10636 5/20 0.35
MEN1 O00255 4/20 0.35
KMT2A Q03164 4/20 0.35
LMNA P02545 1/20 0.35
RAB9A P51151 1/20 0.35
TLR9 Q9NR96 1/20 0.35
PLAU P00749 1/20 0.32
POLB P06746 1/20 0.32
PDE7A Q13946 2/20 0.31
S100A4 P26447 1/20 0.31
TRPV1 Q8NER1 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL432758 0.77 CYP3A4 (0.39) ALDH1A1TDP1CYP3A4TSHRMAPK1
SCHEMBL153657 0.71 ALDH1A1 (0.69) ALDH1A1TDP1CYP3A4ALOX15TSHR
SCHEMBL9408129 0.71 CYP3A4 (0.40) ALDH1A1TDP1CYP3A4TSHRMAPK1
SCHEMBL10400389 0.69 ALDH1A1 (0.58) ALDH1A1TDP1CYP3A4ALOX15TSHR
SCHEMBL908698 0.66 ALDH1A1 (0.51) ALDH1A1TDP1CYP3A4ALOX15TSHR
SCHEMBL1254184 0.66 TDP1 (0.72) ALDH1A1TDP1CYP3A4ALOX15TSHR
SCHEMBL16570514 0.65 TDP1 (0.60) ALDH1A1TDP1CYP3A4ALOX15TSHR
SCHEMBL474215 0.65 ALDH1A1 (0.60) ALDH1A1TDP1CYP3A4ALOX15TSHR
SCHEMBL908697 0.65 TDP1 (0.33) ALDH1A1TDP1CYP3A4ALOX15TSHR
SCHEMBL11038046 0.64 ALDH1A1 (0.58) ALDH1A1TDP1CYP3A4ALOX15TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106947409-B Conductive adhesive composition, conductive adhesive film, adhesive method and circuit base plate 大自达电线股份有限公司 2018-12-11 CN disclosed
CN-104487534-B Cured conductive adhesive composition, electromagnetic wave shielding film, conductive adhesive film, bonding method and circuit substrate 大自达电线股份有限公司 2016-11-09 CN disclosed
CN-106068317-A Electric conductivity plastering agent constituent 大自达电线股份有限公司 2016-11-02 CN disclosed
CN-104379696-B Conductive adhesive composition, conductive adhesive film, bonding method and circuit substrate 大自达电线股份有限公司 2016-10-12 CN disclosed
CN-104487534-A Cured conductive adhesive composition, electromagnetic wave shielding film, conductive adhesive film, bonding method and circuit substrate TATSUTA DENSEN KK 2015-04-01 CN disclosed
CN-104379696-A Conductive adhesive composition, conductive adhesive film, bonding method and circuit substrate TATSUTA DENSEN KK 2015-02-25 CN disclosed
US-5672563-A CONTAINING ULTRAVIOLET ABSORBER REACTED WITH AND BONDED TO A DYE-RECEIVING RESIN DAI NIPPON PRINTING CO., LTD. (JP) 1997-09-30 US disclosed
EP-0543339-B1 Thermal transfer image-receiving sheet DAINIPPON PRINTING CO LTD (JP) 1996-10-16 EP disclosed
US-5545606-A CONTAINING ULTRAVIOLET RADIATION ABSORBER DAI NIPPON PRINTING CO., LTD. (JP) 1996-08-13 US disclosed
US-5405824-A Having ultrafine particles of hexagonal zinc oxide or titanium dioxide ultraviolet absorber in or on dye receiving layer; lightfastness, storage stability DAI NIPPON PRINTING CO., LTD. (JP) 1995-04-11 US disclosed
US-5328888-A Thermal transfer image-receiving sheet DAI NIPPON PRINTING CO., LTD. (JP) 1994-07-12 US disclosed
EP-0543339-A1 Thermal transfer image-receiving sheet DAI NIPPON PRINTING CO., LTD. (JP) 1993-05-26 EP disclosed
EP-0280763-B1 HEAT-SENSITIVE RECORDING MEDIUM DAINICHISEIKA COLOR & CHEMICALS MFG. CO. LTD. (JP) 1993-01-07 EP disclosed
EP-0303729-B1 HEAT-SENSITIVE RECORDING MEDIUM DAINICHISEIKA COLOR & CHEMICALS MFG. CO. LTD. (JP) 1992-12-09 EP disclosed
US-4910087-A Heat sensitive ink transfer recording layer on poly(urethane, urea)silicone resin, heat resistant substrate DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD. (JP) 1990-03-20 US disclosed
US-4895829-A MODIFIED POLYSILOXANE, NONSTICKY DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD. (JP) 1990-01-23 US disclosed
US-4837198-A HEAT RESISTANT LAYER OF RESIN AND MODIFIER WHICH IS REACTION PRODUCT OF FLUORINE COMPOUND AND ORGANIC POLYISOCYANATE DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD. (JP) 1989-06-06 US disclosed
EP-0303729-A1 Heat-sensitive recording medium DAINICHISEIKA COLOR & CHEMICALS MFG. CO. LTD. (JP) 1989-02-22 EP disclosed
EP-0280763-A2 Heat-sensitive recording medium DAINICHISEIKA COLOR & CHEMICALS MFG. CO. LTD. (JP) 1988-09-07 EP disclosed