SCHEMBL8924216

SCHEMBL8924216

C=C(C)C(=O)OCCC[Si](CCCOC(=O)C(=C)C)(CCCOC(=O)C(=C)C)OCCCC

nearest known ligand 0.62

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.62
THRB P10828 1/20 0.46
ALDH1A1 P00352 2/20 0.44
POLB P06746 1/20 0.41
APEX1 P27695 1/20 0.41
HTT P42858 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
HPGD P15428 1/20 0.40
ATM Q13315 1/20 0.38
ACHE P22303 6/20 0.34
HCAR2 Q8TDS4 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
XDH P47989 1/20 0.34
NAAA Q02083 1/20 0.33
MAPT P10636 1/20 0.33
RAB9A P51151 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11801963 0.94 TSHR (0.62) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL72364 0.87 TSHR (0.62) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL8900512 0.87 TSHR (0.62) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL7593517 0.87 TSHR (0.56) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL8899367 0.86 TSHR (0.60) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL16537508 0.86 TSHR (0.56) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL3503924 0.86 TSHR (0.60) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL140538 0.86 TSHR (0.60) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL1269736 0.84 TSHR (0.58) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL2246325 0.84 TSHR (0.58) TSHRTHRBALDH1A1POLBAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5662961-A Method for forming a protective coating film on electronic parts and devices TOKYO OHKA KOGYO CO., LTD. (JP) 1997-09-02 US disclosed
US-5520952-A Method for forming a protective coating film on electronic parts and devices TOKYO OHKA KOGYO CO., LTD. (JP) 1996-05-28 US disclosed