SCHEMBL8925742

SCHEMBL8925742

Oc1ccccc1Cc1ccc(-c2ccc(Cc3ccccc3O)cc2)cc1

nearest known ligand 0.76

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KEAP1 Q14145 1/20 0.76
HSPA5 P11021 1/20 0.65
BCL2 P10415 1/20 0.50
BCL2L1 Q07817 1/20 0.50
ALOX5 P09917 1/20 0.48
HIF1A Q16665 2/20 0.46
CYP2D6 P10635 1/20 0.46
TSHR P16473 1/20 0.46
CA2 P00918 2/20 0.46
CA1 P00915 1/20 0.46
CA9 Q16790 1/20 0.46
MEN1 O00255 1/20 0.46
CYP3A4 P08684 1/20 0.46
HPGD P15428 1/20 0.46
ALOX15 P16050 1/20 0.46
KMT2A Q03164 1/20 0.46
HSD17B10 Q99714 1/20 0.46
TAAR1 Q96RJ0 1/20 0.45
AKR1B1 P15121 1/20 0.45
IDO1 P14902 2/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9776607 0.93 KEAP1 (0.86) KEAP1HSPA5BCL2BCL2L1ALOX5
SCHEMBL30616875 0.93 KEAP1 (0.86) KEAP1HSPA5BCL2BCL2L1ALOX5
SCHEMBL12589848 0.92 KEAP1 (0.85) KEAP1HSPA5BCL2BCL2L1ALOX5
SCHEMBL68653 0.86 KEAP1 (1.00) KEAP1HSPA5BCL2BCL2L1ALOX5
SCHEMBL29506902 0.86 KEAP1 (1.00) KEAP1HSPA5BCL2BCL2L1ALOX5
SCHEMBL87816 0.86 KEAP1 (0.75) KEAP1HSPA5BCL2BCL2L1ALOX5
SCHEMBL30335116 0.86 KEAP1 (0.75) KEAP1HSPA5BCL2BCL2L1ALOX5
SCHEMBL920838 0.84 KEAP1 (0.96) KEAP1HSPA5BCL2BCL2L1ALOX5
SCHEMBL27996044 0.84 KEAP1 (0.56) KEAP1HSPA5BCL2BCL2L1ALOX5
SCHEMBL28998999 0.84 KEAP1 (0.72) KEAP1HSPA5BCL2BCL2L1ALOX5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-9255603-A None JP disclosed
US-7968672-B2 Phenolic resin, process for production thereof, epoxy resin, and use thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2011-06-28 US disclosed
US-7968672-B2 Phenolic resin, process for production thereof, epoxy resin, and use thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2011-06-28 US disclosed
US-20090286929-A1 Phenolic Resin, Process for Production Thereof, Epoxy Resin, and Use Thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2009-11-19 US disclosed
US-20090286929-A1 Phenolic Resin, Process for Production Thereof, Epoxy Resin, and Use Thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2009-11-19 US disclosed
JP-H09255603-A BIS(HIDROXYBENZYL)BIPHENYL AND ITS PRODUCTION MEIWA KASEI KK 1997-09-30 JP disclosed