SCHEMBL8928264

SCHEMBL8928264

C=Cc1ccc(S(=O)(=O)OC(C)C)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.50
ALDH1A1 P00352 5/20 0.41
TAS1R3 Q7RTX0 2/20 0.33
TAS1R1 Q7RTX1 2/20 0.33
TSHR P16473 2/20 0.32
ALDH1A3 P47895 1/20 0.32
NPC1 O15118 1/20 0.32
LMNA P02545 1/20 0.32
TP53 P04637 1/20 0.32
MAPT P10636 1/20 0.32
XBP1 P17861 1/20 0.32
MAPK1 P28482 1/20 0.32
HTT P42858 1/20 0.32
RAB9A P51151 1/20 0.32
MDM2 Q00987 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
HSD17B10 Q99714 1/20 0.32
HDAC8 Q9BY41 1/20 0.32
CYP24A1 Q07973 1/20 0.32
EGFR P00533 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12891204 0.86 TDP1 (0.47) TDP1ALDH1A1TAS1R3TAS1R1TSHR
SCHEMBL8846531 0.83 TDP1 (0.44) TDP1ALDH1A1TAS1R3TAS1R1CYP24A1
SCHEMBL14336271 0.82 TDP1 (0.43) TDP1ALDH1A1TAS1R3TAS1R1
SCHEMBL5478255 0.80 TDP1 (0.42) TDP1ALDH1A1TAS1R3TAS1R1NPC1
SCHEMBL13078557 0.79 TAS1R3 (0.45) TDP1ALDH1A1TAS1R3TAS1R1MAPK1
SCHEMBL313290 0.79 TDP1 (0.55) TDP1ALDH1A1TSHRNPC1LMNA
SCHEMBL8846474 0.77 TDP1 (0.46) TDP1ALDH1A1TAS1R3TAS1R1TSHR
SCHEMBL9278983 0.77 ALDH1A1 (0.44) ALDH1A1TSHRLMNATP53MAPT
SCHEMBL143705 0.76 GAA (0.50) TDP1ALDH1A1TSHRLMNAMAPT
SCHEMBL11126593 0.76 TDP1 (0.49) TDP1ALDH1A1TAS1R3TAS1R1NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8252364-B2 Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same FUJIFILM CORPORATION (JP) 2012-08-28 US disclosed
US-8187664-B2 Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same FUJIFILM CORPORATION (JP) 2012-05-29 US disclosed
US-20110088934-A1 METAL PATTERN FORMING METHOD, METAL PATTERN OBTAINED BY THE SAME, PRINTED WIRING BOARD, CONDUCTIVE FILM FORMING METHOD, AND CONDUCTIVE FILM OBTAINED BY THE SAME FUJIFILM CORPORATION (JP) 2011-04-21 US disclosed
US-20090269606-A1 METHOD FOR FORMING METAL FILM AND METHOD FOR FORMING METAL PATTERN FUJIFLIM CORPORATION (JP) 2009-10-29 US disclosed
US-20090022885-A1 METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME FUJIFILM CORPORATION (JP) 2009-01-22 US disclosed
US-7438950-B2 Metallic pattern forming method and conductive pattern material FUJIFILM CORPORATION (JP) 2008-10-21 US disclosed
US-7306895-B2 Pattern forming method, image forming method, fine particle adsorption pattern forming method, conductive pattern forming method, pattern forming material and planographic printing plate FUJIFILM CORPORATION (JP) 2007-12-11 US disclosed
US-7306895-B2 Pattern forming method, image forming method, fine particle adsorption pattern forming method, conductive pattern forming method, pattern forming material and planographic printing plate FUJIFILM CORPORATION (JP) 2007-12-11 US disclosed
EP-0903224-B1 Radiation-sensitive planographic plate precursor and planographic plate FUJIFILM CORP (JP) 2007-11-14 EP disclosed
US-20070246249-A1 Metal Pattern Forming Methd, Metal Pattern Obtained by the Same, Printed Wiring Board, Conductive Film Forming Method, and Conductive Film Obtained by the Same FUJI PHOTO FILM CO., LTD. (JP) 2007-10-25 US disclosed
US-20070246249-A1 Metal Pattern Forming Methd, Metal Pattern Obtained by the Same, Printed Wiring Board, Conductive Film Forming Method, and Conductive Film Obtained by the Same FUJI PHOTO FILM CO., LTD. (JP) 2007-10-25 US disclosed
US-7279195-B2 Method of forming metal fine particle pattern and method of forming electroconductive pattern FUJIFILM CORPORATION (JP) 2007-10-09 US disclosed
US-7279195-B2 Method of forming metal fine particle pattern and method of forming electroconductive pattern FUJIFILM CORPORATION (JP) 2007-10-09 US disclosed
US-7157193-B2 Image forming material, color filter master plate, and color filter FUJI PHOTO FILM CO., LTD. (JP) 2007-01-02 US disclosed
US-7157193-B2 Image forming material, color filter master plate, and color filter FUJI PHOTO FILM CO., LTD. (JP) 2007-01-02 US disclosed