SCHEMBL8952658

SCHEMBL8952658

CCCCN[SiH2]C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27491537 0.91
SCHEMBL27630316 0.88
Butylamine SCHEMBL1536123 0.87 DNM1 (0.42)
SCHEMBL12228805 0.80
SCHEMBL888678 0.78 TSHR (0.45)
SCHEMBL17409612 0.78 TSHR (0.45)
SCHEMBL18991366 0.73
SCHEMBL17046176 0.73
SCHEMBL22342226 0.73
SCHEMBL20130854 0.71 TSHR (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4241299-A1 SELECTIVE THERMAL ATOMIC LAYER DEPOSITION Versum Materials US, LLC (US) 2023-09-13 EP claimed
EP-4240886-A1 SELECTIVE PLASMA ENHANCED ATOMIC LAYER DEPOSITION Versum Materials US, LLC (US) 2023-09-13 EP claimed
WO-2022119860-A9 SELECTIVE THERMAL ATOMIC LAYER DEPOSITION VERSUM MATERIAL US, LLC (US) 2023-08-24 WO claimed
EP-4013903-A1 COMPOSITIONS AND METHODS USING SAME FOR NON-CONFORMAL DEPOSITION OF SILICON-CONTAINING FILMS Versum Materials US, LLC (US) 2022-06-22 EP claimed
WO-2022119860-A1 SELECTIVE THERMAL ATOMIC LAYER DEPOSITION VERSUM MATERIAL US, LLC (US) 2022-06-09 WO claimed
WO-2022119865-A1 SELECTIVE PLASMA ENHANCED ATOMIC LAYER DEPOSITION VERSUM MATERIALS US, LLC (US) 2022-06-09 WO claimed
WO-2021050368-A1 COMPOSITIONS AND METHODS USING SAME FOR NON-CONFORMAL DEPOSITION OF SILICON-CONTAINING FILMS VERSUM MATERIALS US, LLC (US) 2021-03-18 WO claimed
EP-4241299-A1 SELECTIVE THERMAL ATOMIC LAYER DEPOSITION Versum Materials US, LLC (US) 2023-09-13 EP disclosed
EP-4240886-A1 SELECTIVE PLASMA ENHANCED ATOMIC LAYER DEPOSITION Versum Materials US, LLC (US) 2023-09-13 EP disclosed
WO-2022119860-A9 SELECTIVE THERMAL ATOMIC LAYER DEPOSITION VERSUM MATERIAL US, LLC (US) 2023-08-24 WO disclosed
WO-2022119860-A1 SELECTIVE THERMAL ATOMIC LAYER DEPOSITION VERSUM MATERIAL US, LLC (US) 2022-06-09 WO disclosed
WO-2022119865-A1 SELECTIVE PLASMA ENHANCED ATOMIC LAYER DEPOSITION VERSUM MATERIALS US, LLC (US) 2022-06-09 WO disclosed
EP-3390410-B1 METHODS OF MAKING HIGH PURITY TRISILYLAMINE NATA SEMICONDUCTOR MAT CO LTD (CN) 2022-02-02 EP disclosed
CN-108602840-A High-purity trimethylsilyl amine, preparation method and purposes 美国陶氏有机硅公司 2018-09-28 CN disclosed
WO-2017106632-A1 METHOD FOR MAKING AN ORGANOAMINOSILANE; A METHOD FOR MAKING A SILYLAMINE FROM THE ORGANOAMINOSILANE DOW CORNING CORPORATION (US) 2017-06-22 WO disclosed
WO-2017106625-A1 HIGH PURITY TRISILYLAMINE, METHODS OF MAKING, AND USE DOW CORNING CORPORATION (US) 2017-06-22 WO disclosed
CN-101094888-B Reactive Silicic Acid Suspension WACKER CHEMIE AG 2011-05-04 CN disclosed
CN-101094888-A Reactive Silicic Acid Suspension WACKER CHEMIE AG (DE) 2007-12-26 CN disclosed
US-5576247-A ATTACHING HYDROPHOBIC ORGANIC GROUPS TO BORON-PHOSPHOROUS-SILICA LAYER TO PROVIDE MOISTURE BARRIER, REACTION WITH HEXAMETHYDISILAZANE MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1996-11-19 US disclosed
EP-0017734-A1 Curable organopolysiloxane compositions containing carbon black, method for preparing the same and method for curing the compositions SWS Silicones Corporation (US) 1980-10-29 EP disclosed