SCHEMBL8958030

SCHEMBL8958030

Cc1ccccc1C(C)Cc1ncc[nH]1

nearest known ligand 0.51

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
▸ TAAR1 Q96RJ0 11/20 0.51
▸ NR3C2 P08235 1/20 0.42
▸ HTR1A P08908 1/20 0.39
▸ ADRA2A P08913 2/20 0.38
▸ ADRA2B P18089 2/20 0.38
▸ ADRA2C P18825 2/20 0.38
▸ CYP2D6 P10635 1/20 0.37
▸ TSHR P16473 1/20 0.37
▸ LMNA P02545 1/20 0.36
▸ GLA P06280 1/20 0.36
▸ BLM P54132 1/20 0.36
▸ PMP22 Q01453 1/20 0.36
▸ SMN1; SMN2 Q16637 1/20 0.36
▸ ADRB2 P07550 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11299695 0.83 TAAR1 (0.50) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL3773150 0.79 TAAR1 (0.53) TAAR1HTR1ACYP2D6TSHRLMNA
SCHEMBL11047832 0.78 TAAR1 (0.48) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL9021052 0.76 ADRB2 (0.44) TAAR1ADRA2CCYP2D6ADRB2
SCHEMBL11289039 0.75 TAAR1 (0.51) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL3530042 0.74 TAAR1 (0.50) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL7690411 0.73 TAAR1 (0.44) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL11293853 0.72 TAAR1 (0.55) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL20865041 0.72 TAAR1 (0.41) TAAR1HTR1A
SCHEMBL29783451 0.72 TAAR1 (0.41) TAAR1HTR1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 — — EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 — — US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 — — EP disclosed
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