SCHEMBL8970972

SCHEMBL8970972

C=CCC(CC(CC)CCCC)N1C(=O)C2C3C=CC(C3)C2C1=O

nearest known ligand 0.37

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 2/20 0.37
KMT2A Q03164 2/20 0.37
ALDH1A1 P00352 5/20 0.36
RAB9A P51151 1/20 0.35
SMN1; SMN2 Q16637 4/20 0.34
LMNA P02545 2/20 0.34
TSHR P16473 4/20 0.33
HTT P42858 2/20 0.33
USP2 O75604 1/20 0.33
HSD17B10 Q99714 1/20 0.33
KDM4E B2RXH2 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
RECQL P46063 1/20 0.32
L3MBTL1 Q9Y468 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8971763 0.84 MEN1 (0.39) MEN1KMT2AALDH1A1RAB9ASMN1; SMN2
SCHEMBL8970956 0.80 MEN1 (0.46) MEN1KMT2AALDH1A1RAB9ASMN1; SMN2
SCHEMBL28375540 0.79 MEN1 (0.49) MEN1KMT2AALDH1A1RAB9ASMN1; SMN2
SCHEMBL28373150 0.76 MEN1 (0.47) MEN1KMT2AALDH1A1RAB9ASMN1; SMN2
SCHEMBL8971748 0.75 TSHR (0.46) MEN1KMT2AALDH1A1RAB9ASMN1; SMN2
SCHEMBL8971864 0.75 HTT (0.43) MEN1KMT2AALDH1A1RAB9ASMN1; SMN2
SCHEMBL28369420 0.74 MEN1 (0.46) MEN1KMT2AALDH1A1RAB9ASMN1; SMN2
SCHEMBL31372460 0.74 ALDH1A1 (0.51) MEN1KMT2AALDH1A1RAB9ASMN1; SMN2
SCHEMBL29911378 0.74 ALDH1A1 (0.51) MEN1KMT2AALDH1A1RAB9ASMN1; SMN2
SCHEMBL28369293 0.74 MEN1 (0.46) MEN1KMT2AALDH1A1RAB9ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5521260-A ALKENYLNADIMIDE, VINYL COMPOUND, PHENOLIC RESIN MARUZEN PETROCHEMICAL CO., LTD. (JP) 1996-05-28 US disclosed
US-4885346-A HEAT CURABLE; MOLDING MATERIALS CIBA-GEIGY CORPORATION (US) 1989-12-05 US disclosed
US-4745166-A Heat-curable mixture containing substituted bicyclo (2.2.1) hept-5-ene-2,3-dicarboximide and polymaleimide, and ethylenically unsaturated phenolic compound CIBA-GEIGY CORPORATION (US) 1988-05-17 US disclosed
US-4678849-A PREPREGS, COMPOSITES, COATINGS CIBA-GEIGY CORPORATION (US) 1987-07-07 US disclosed