SCHEMBL8977694

SCHEMBL8977694

NC1CCC(CC2CCCCC2)(CC2CCCCC2)CC1

nearest known ligand 0.44

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
SIGMAR1 Q99720 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9821146 0.80 CHRM5 (0.33) SIGMAR1
SCHEMBL31118157 0.73 USP2 (0.38) SIGMAR1
SCHEMBL22447924 0.70 MGAM (0.32) SIGMAR1
SCHEMBL23070862 0.67 SIGMAR1 (0.31) SIGMAR1
SCHEMBL11849600 0.67 SIGMAR1 (0.33) SIGMAR1
SCHEMBL992288 0.67
SCHEMBL9191759 0.65 OPRL1 (0.33)
SCHEMBL21288302 0.65 CYP2D6 (0.47) SIGMAR1
SCHEMBL1987161 0.65 NOS1 (0.39) SIGMAR1
Decarboxylated Derivative SCHEMBL11422051 0.65 CYP2D6 (0.47) SIGMAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0554823-B1 Epoxy resins cured with mixed methylene bridged poly(cyclohexyl-aromatic)amine curing agents AIR PROD & CHEM (US) 1996-04-24 EP claimed
US-5414067-A Raising the temperature of the curable epoxy group polymers to speed curing AIR PRODUCTS AND CHEMICALS, INC. (US) 1995-05-09 US claimed
US-5414067-A Raising the temperature of the curable epoxy group polymers to speed curing AIR PRODUCTS AND CHEMICALS, INC. (US) 1995-05-09 US disclosed