SCHEMBL9017688

SCHEMBL9017688

NCCNCCO.NCCOCCO

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 4/20 0.43
CA6 P23280 4/20 0.43
CA7 P43166 4/20 0.43
CA9 Q16790 4/20 0.43
CA14 Q9ULX7 4/20 0.43
CA5B Q9Y2D0 4/20 0.43
MEN1 O00255 4/20 0.43
KMT2A Q03164 4/20 0.43
TSHR P16473 2/20 0.43
RECQL P46063 2/20 0.43
MAPK1 P28482 1/20 0.43
CA2 P00918 3/20 0.42
CA4 P22748 3/20 0.42
CA5A P35218 3/20 0.42
ALOX15 P16050 3/20 0.42
LMNA P02545 2/20 0.42
TDP1 Q9NUW8 2/20 0.42
CA3 P07451 2/20 0.42
TP53 P04637 2/20 0.42
CA1 P00915 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Diethanolamine SCHEMBL10897038 0.96 TSHR (0.48) CA12CA6CA7CA9CA14
SCHEMBL394398 0.86 CA12 (0.48) CA12CA6CA7CA9CA14
SCHEMBL394823 0.86 TSHR (0.40) CA12CA6CA7CA9CA14
SCHEMBL24040362 0.84 MEN1 (0.50) CA12CA6CA7CA9CA14
SCHEMBL14980618 0.84 TSHR (0.42) CA12CA6CA7CA9CA14
SCHEMBL10151431 0.84 MEN1 (0.50) CA12CA6CA7CA9CA14
SCHEMBL9501060 0.84 MEN1 (0.50) CA12CA6CA7CA9CA14
SCHEMBL19189861 0.84 MEN1 (0.50) CA12CA6CA7CA9CA14
Diethanolamine SCHEMBL9560447 0.83 TSHR (0.62) MEN1KMT2ATSHRMAPK1ALOX15
SCHEMBL6130682 0.83 CA12 (0.48) CA12CA6CA7CA9CA14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5498293-A TREATMENT WITH ALKALINE SOLUTION AND AMPHOTERIC SURFACTANT MALLINCKRODT BAKER, INC. (US) 1996-03-12 US disclosed
EP-0690483-A2 Cleaning wafer substrates of metal contamination while maintaining wafer smoothness MALLINCKRODT BAKER, Inc. (US) 1996-01-03 EP disclosed