SCHEMBL904504

SCHEMBL904504

C=CC(=O)OC(CC)CCCCC1CO1

nearest known ligand 0.38

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.38
TSHR P16473 2/20 0.35
HPGD P15428 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11653794 0.90 TSHR (0.35) ALDH1A1TSHRHPGD
SCHEMBL19456905 0.82 TSHR (0.45) ALDH1A1TSHRHPGD
SCHEMBL28726869 0.82 ALDH1A1 (0.39) ALDH1A1TSHR
SCHEMBL4246013 0.81 TSHR (0.33) ALDH1A1TSHRHPGD
SCHEMBL27498746 0.81 ALDH1A1 (0.45) ALDH1A1TSHR
SCHEMBL2785282 0.79 TSHR (0.42) ALDH1A1TSHRHPGD
SCHEMBL5691662 0.79 TSHR (0.31) TSHR
SCHEMBL16008 0.79 TSHR (0.50) TSHRHPGD
SCHEMBL11648876 0.78 TSHR (0.35) ALDH1A1TSHRHPGD
SCHEMBL665164 0.77 TSHR (0.49) ALDH1A1TSHRHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7371499-B2 Photoresist resin composition, method of forming a photoresist pattern, and method of manufacturing a display substrate using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-05-13 US claimed
US-20070128540-A1 PHOTORESIST RESIN COMPOSITION, METHOD OF FORMING A PHOTORESIST PATTERN, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-06-07 US claimed
CN-119768741-A Positive photosensitive resin composition 日产化学株式会社 2025-04-04 CN disclosed
CN-117677901-A Positive photosensitive resin composition 日产化学株式会社 2024-03-08 CN disclosed
CN-107614542-B Method for producing elliptical, needle-like or rod-like polymer particles 日清纺控股株式会社 2020-03-03 CN disclosed
WO-2012044099-A2 PHOTOSENSITIVE RESIN COMPOSITION KOLON INDUSTRIES, INC. (KR) 2012-04-05 WO disclosed
US-7371499-B2 Photoresist resin composition, method of forming a photoresist pattern, and method of manufacturing a display substrate using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-05-13 US disclosed
US-20070128540-A1 PHOTORESIST RESIN COMPOSITION, METHOD OF FORMING A PHOTORESIST PATTERN, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-06-07 US disclosed
US-6984476-B2 Radiation-sensitive resin composition, forming process for forming patterned insulation film, active matrix board and flat-panel display device equipped with the same, and process for producing flat-panel display device SHARP KABUSHIKI KAISHA (JP) 2006-01-10 US disclosed
US-20030193624-A1 Radiation-sensitive resin composition, forming process for forming patterned insulation film, active matrix board and flat-panel display device equipped with the same, and process for producing flat-panel display device SHARP KABUSHIKI KAISHA (JP) 2003-10-16 US disclosed