SCHEMBL4246013

SCHEMBL4246013

C=CC(=O)OC(CC)CC1CO1

nearest known ligand 0.33

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.33
ALDH1A1 P00352 2/20 0.33
HPGD P15428 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27998176 0.90 ALDH1A1 (0.33) TSHRALDH1A1
SCHEMBL9546032 0.88 TSHR (0.35) TSHRALDH1A1HPGD
SCHEMBL2785282 0.85 TSHR (0.42) TSHRALDH1A1HPGD
SCHEMBL11653794 0.84 TSHR (0.35) TSHRALDH1A1HPGD
SCHEMBL15392339 0.83 HTT (0.34) HPGD
SCHEMBL21084068 0.82 ALDH1A1 (0.46) TSHRALDH1A1HPGD
SCHEMBL904504 0.81 ALDH1A1 (0.38) TSHRALDH1A1HPGD
SCHEMBL3675161 0.80 TSHR (0.39) TSHRALDH1A1HPGD
SCHEMBL561301 0.78 TSHR (0.45) TSHRALDH1A1HPGD
SCHEMBL28844208 0.78 ALDH1A1 (0.33) TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7611826-B2 Photosensitive resin composition controlling solubility and pattern formation method of double-layer structure using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-11-03 US claimed
US-20090191484-A1 PHOTOSENSITIVE RESIN COMPOSITION CONTROLLING SOLUBILITY AND PATTERN FORMATION METHOD OF DOUBLE-LAYER STRUCTURE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-07-30 US claimed
US-20040115558-A1 Photosensitive resin composition controlling solubility and pattern formation method of double-layer structure using the same DONGJIM SEMICHEM CO., LTD. (KR) 2004-06-17 US claimed
US-5061587-A Image fixing at high speed RICOH COMPANY LTD. (JP) 1991-10-29 US claimed
US-4855215-A Photosetting polymer composition UBE INDUSTRIES, LTD. (JP) 1989-08-08 US claimed
US-7611826-B2 Photosensitive resin composition controlling solubility and pattern formation method of double-layer structure using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-11-03 US disclosed
US-20090191484-A1 PHOTOSENSITIVE RESIN COMPOSITION CONTROLLING SOLUBILITY AND PATTERN FORMATION METHOD OF DOUBLE-LAYER STRUCTURE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-07-30 US disclosed
US-7513942-B2 Fine particle dispersion, ink composition using the same, and ink-jet recording method FUJIFILM CORPORATION (JP) 2009-04-07 US disclosed
US-20050206713-A1 Fine particle dispersion, ink composition using the same, and ink-jet recording method FUJI PHOTO FILM CO., LTD. 2005-09-22 US disclosed
US-20040115558-A1 Photosensitive resin composition controlling solubility and pattern formation method of double-layer structure using the same DONGJIM SEMICHEM CO., LTD. (KR) 2004-06-17 US disclosed
US-20020177071-A1 Method for forming image and apparatus for forming image MITSUBISHI CHEMICAL CORPORATION (JP) 2002-11-28 US disclosed
US-5061587-A Image fixing at high speed RICOH COMPANY LTD. (JP) 1991-10-29 US disclosed