SCHEMBL9062129

SCHEMBL9062129

Cc1cc(-c2cc(C)c(O)c(C)c2Br)cc(C)c1O

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.52
CA2 P00918 1/20 0.52
CYP1A2 P05177 3/20 0.36
CYP2C9 P11712 3/20 0.36
CYP2C19 P33261 2/20 0.36
ESR1 P03372 1/20 0.33
ESR2 Q92731 1/20 0.33
ALDH1A1 P00352 3/20 0.32
GAA P10253 3/20 0.32
CYP3A4 P08684 2/20 0.32
CYP2D6 P10635 2/20 0.32
EEF2K O00418 1/20 0.32
SRC P12931 1/20 0.32
TP53 P04637 1/20 0.32
HPGD P15428 1/20 0.32
ALOX15 P16050 1/20 0.32
ALOX12 P18054 1/20 0.32
HIF1A Q16665 1/20 0.32
HSD17B10 Q99714 1/20 0.32
FYN P06241 3/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11820209 0.87 CA1 (0.42) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL3752346 0.80 CA1 (0.59) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL9571457 0.80 CA1 (0.59) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL846647 0.79 CA1 (0.36) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL9063967 0.75 CA1 (0.52) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL9683862 0.75 CA1 (0.43) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL29768668 0.75 CA1 (0.43) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL922255 0.74 CA1 (0.56) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL86951 0.73 CA1 (0.42) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL6433514 0.73 CA1 (0.44) CA1CA2CYP1A2CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0403022-B1 Encapsulating epoxy resin composition SHELL INT RESEARCH (NL) 1996-11-13 EP disclosed
EP-0442568-B1 Epoxy resin compositions for encapsulating semiconductive elements SHELL INT RESEARCH (NL) 1995-12-06 EP disclosed
US-5149730-A Diglycidyl ether of 4,4*-dihydroxybiphenyl, trisphenolic curing agent, cure accelerator, inorganic filler SHELL OIL COMPANY (US) 1992-09-22 US disclosed
US-5089543-A Phenolic curing agent and tris/dialkoxyphenyl/phosphine SHELL OIL COMPANY (US) 1992-02-18 US disclosed
EP-0442568-A2 Epoxy resin compositions for encapsulating semiconductive elements SHELL INTERNATIONALE RESEARCHMAATSCHAPPIJ B.V. (NL) 1991-08-21 EP disclosed
EP-0403022-A2 Encapsulating epoxy resin composition SHELL INTERNATIONALE RESEARCHMAATSCHAPPIJ B.V. (NL) 1990-12-19 EP disclosed