SCHEMBL907653

SCHEMBL907653

CCCCB(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL369623 0.91 TSHR (0.39)
SCHEMBL14714228 0.88 TSHR (0.44)
SCHEMBL8967219 0.80
SCHEMBL1418560 0.75 ANPEP (0.43)
SCHEMBL14983319 0.73 ANPEP (0.41)
SCHEMBL12042260 0.73
SCHEMBL10942095 0.73 ANPEP (0.41)
SCHEMBL8610175 0.73
SCHEMBL4274113 0.73 ANPEP (0.41)
SCHEMBL7129181 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116063604-B Bimodal polyethylene resin for pipe material product, preparation method thereof and pipe material product 中国石油化工股份有限公司 2024-11-19 CN disclosed
US-11803122-B2 Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 US disclosed
US-11754926-B2 Method of forming resist pattern, resist composition and method of producing the same TOKYO OHKA KOGYO CO., LTD. (JP) 2023-09-12 US disclosed
US-20230273521-A1 CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-31 US disclosed
US-20230229084-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-20 US disclosed
CN-116063604-A Bimodal polyethylene resin for pipe material product, preparation method thereof and pipe material product 中国石油化工股份有限公司 2023-05-05 CN disclosed
US-20230127914-A1 RESIST PATTERN FORMATION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2023-04-27 US disclosed
CN-109963827-A The method for preparing paraxylene by the methylation of toluene and/or benzene 埃克森美孚化学专利公司 2019-07-02 CN disclosed
US-8945820-B2 Silicon-containing resist underlayer film-forming composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-02-03 US disclosed
US-20130137271-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-05-30 US disclosed
US-20030009046-A1 Preparation of preparing substituted indanones EQUISTAR CHEMICALS, LP 2003-01-09 US disclosed
EP-0519496-B1 Thermosetting copolymers, silicon carbide-based fiber and processes for producing same TONEN CORP (JP) 1996-05-22 EP disclosed
EP-0404503-B1 Boron-containing, silicon nitride-based ceramic shaped body production process TONEN CORP (JP) 1996-03-06 EP disclosed
EP-0389084-B1 Process for producing a polyborosilazane TONEN CORP (JP) 1995-09-20 EP disclosed
US-5292830-A Silane, silazane, boron block crosslinked copolymers TONEN CORPORATION (JP) 1994-03-08 US disclosed
EP-0519496-A1 Thermosetting copolymers, silicon carbide-based fiber and processes for producing same Tonen Corporation (JP) 1992-12-23 EP disclosed
US-5128286-A BORON-CONTAINING, SILICON NITRIDE-BASED CERAMIC SHAPED BODY TONEN CORPORATION (JP) 1992-07-07 US disclosed
US-5030744-A Polyborosilazane and process for producing same TONEN CORPORATION (JP) 1991-07-09 US disclosed
EP-0404503-A1 Boron-containing, silicon nitride-based ceramic shaped body production process Tonen Corporation (JP) 1990-12-27 EP disclosed
EP-0389084-A2 Process for producing a polyborosilazane Tonen Corporation (JP) 1990-09-26 EP disclosed