SCHEMBL907802

SCHEMBL907802

CC1=CC(=O)N(CCCCCCN2C(=O)C=C(C)C2=O)C1=O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 5/20 0.48
FAAH O00519 3/20 0.48
ALDH1A1 P00352 2/20 0.48
LMNA P02545 2/20 0.48
HTT P42858 2/20 0.48
RECQL P46063 2/20 0.48
RAB9A P51151 2/20 0.48
SMN1; SMN2 Q16637 2/20 0.48
HSP90AA1 P07900 1/20 0.48
TLR9 Q9NR96 1/20 0.48
TP53 P04637 1/20 0.48
MAPT P10636 1/20 0.48
PKM P14618 1/20 0.48
HPGD P15428 1/20 0.48
XBP1 P17861 1/20 0.48
MAPK1 P28482 1/20 0.48
NPSR1 Q6W5P4 1/20 0.48
GPR35 Q9HC97 1/20 0.48
GPR55 Q9Y2T6 1/20 0.48
PTGS1 P23219 7/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8886884 1.00 MGLL (0.48) MGLLFAAHALDH1A1LMNAHTT
SCHEMBL8886103 1.00 MGLL (0.48) MGLLFAAHALDH1A1LMNAHTT
SCHEMBL8442748 1.00 MGLL (0.48) MGLLFAAHALDH1A1LMNAHTT
SCHEMBL8885012 1.00 MGLL (0.48) MGLLFAAHALDH1A1LMNAHTT
SCHEMBL8443620 1.00 MGLL (0.48) MGLLFAAHALDH1A1LMNAHTT
SCHEMBL8443081 1.00 MGLL (0.48) MGLLFAAHALDH1A1LMNAHTT
SCHEMBL8887050 1.00 MGLL (0.48) MGLLFAAHALDH1A1LMNAHTT
SCHEMBL8883684 0.98 MGLL (0.46) MGLLFAAHALDH1A1LMNAHTT
SCHEMBL8885500 0.93 MGLL (0.41) MGLLFAAHALDH1A1LMNAHTT
SCHEMBL18999087 0.92 MGLL (0.58) MGLLFAAHALDH1A1LMNAHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 86 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6943217-B2 Golf ball cores formed from unsaturated organic imide co-curing agents ACUSHNET COMPANY (US) 2005-09-13 US claimed
US-5340851-A Curable mixture of imide compounds, epoxy resins, phenolic resins and polysiloxanes; mechanical strength, hot-waterproof SHIN-ETSU CHEMICAL COMPANY, LTD. (JP) 1994-08-23 US claimed
EP-0378457-B1 Aromatic allyl amine thermosetting resin composition SUMITOMO CHEMICAL CO (JP) 1994-08-03 EP claimed
EP-0363460-B1 EPOXY-AMINE COMPOSITIONS EMPLOYING UNSATURATED IMIDES LOCTITE CORP (US) 1993-12-22 EP claimed
US-5109087-A Polymaleimide comonomer SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1992-04-28 US claimed
EP-0378457-A2 Aromatic allyl amine thermosetting resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1990-07-18 EP claimed
US-4886842-A PHOTOCURABLE BLEND; HEAT-RESISTANT ADHESIVES FOR ELECTRICAL COMPONENTS LOCTITE CORPORATION (US) 1989-12-12 US claimed
US-4837295-A IMPROVED INITIAL ADHESION AND THERMAL SHOCK RESISTANCE LOCTITE CORPORATION (US) 1989-06-06 US claimed
CN-110845387-B Bis (citraconimido) hydrocarbon, preparation method thereof and application thereof as anti-reversion agent 山东阳谷华泰化工股份有限公司 2023-05-09 CN disclosed
US-8597734-B2 Curing system and coatings obtained thereof FLEXSYS AMERICA L.P. 2013-12-03 US disclosed
EP-2222748-B1 EPOXY CURING SYSTEM AND COATINGS OBTAINED THEREOF LANXESS DEUTSCHLAND GMBH (DE) 2011-10-26 EP disclosed
US-20110014383-A1 CURING SYSTEM AND COATINGS OBTAINED THEREOF FLEXSYS AMERICA L.P. 2011-01-20 US disclosed
US-7786219-B2 Cyanate-terminated polyphenylene ether MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2010-08-31 US disclosed
US-20100048826-A1 Polyphenylene ether oligomer compound, derivatives thereof and use thereof ISHII KENJI 2010-02-25 US disclosed
WO-1989008122-A1 EPOXY-AMINE COMPOSITIONS EMPLOYING UNSATURATED IMIDES LOCTITE CORPORATION (US) 1989-09-08 WO disclosed
US-4837295-A IMPROVED INITIAL ADHESION AND THERMAL SHOCK RESISTANCE LOCTITE CORPORATION (US) 1989-06-06 US disclosed
US-4808717-A HEAT RESISTANCE, WATER PROOFING, ENCAPSULATING ELECTRONIC COMPONENTS SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1989-02-28 US disclosed
US-4755569-A Thermosetting resin composition comprising a partly allylated novolac epoxy resin and bismaleimide SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1988-07-05 US disclosed
EP-0263915-A2 Thermosetting resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1988-04-20 EP disclosed
EP-0225174-A2 Thermosetting resin composition and a composite material comprising the cured product of the resin composition as its matrix SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1987-06-10 EP disclosed