Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KMT2A | Q03164 | 4/20 | 0.50 |
| ▸ | MEN1 | O00255 | 3/20 | 0.50 |
| ▸ | GAA | P10253 | 3/20 | 0.50 |
| ▸ | ESR1 | P03372 | 1/20 | 0.50 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.50 |
| ▸ | LMNA | P02545 | 2/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.44 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.44 |
| ▸ | VDR | P11473 | 1/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.43 |
| ▸ | MAPT | P10636 | 1/20 | 0.43 |
| ▸ | HTT | P42858 | 1/20 | 0.43 |
| ▸ | DHODH | Q02127 | 1/20 | 0.43 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.41 |
| ▸ | CA1 | P00915 | 2/20 | 0.41 |
| ▸ | CA2 | P00918 | 2/20 | 0.41 |
| ▸ | MMP1 | P03956 | 1/20 | 0.41 |
| ▸ | MMP2 | P08253 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8055604 | 0.80 | MEN1 (0.65) | KMT2AMEN1GAAESR1ESR2 | |
| SCHEMBL30068997 | 0.78 | KMT2A (0.47) | KMT2AMEN1GAAESR1ESR2 | |
| SCHEMBL6230287 | 0.77 | KMT2A (0.43) | KMT2AMEN1GAAESR1ESR2 | |
| SCHEMBL7575551 | 0.76 | MEN1 (0.52) | KMT2AMEN1GAAESR1ESR2 | |
| SCHEMBL7575557 | 0.76 | MEN1 (0.52) | KMT2AMEN1GAAESR1ESR2 | |
| SCHEMBL952515 | 0.76 | KEAP1 (0.45) | KMT2AMEN1GAAESR1ESR2 | |
| SCHEMBL28584784 | 0.76 | RAPGEF4 (0.53) | KMT2AMEN1GAAESR1ESR2 | |
| SCHEMBL6935683 | 0.76 | KMT2A (0.51) | KMT2AMEN1GAAESR1ESR2 | |
| SCHEMBL11356918 | 0.76 | MEN1 (0.47) | KMT2AMEN1GAAESR1ESR2 | |
| SCHEMBL9059778 | 0.75 | STAT3 (0.47) | KMT2AMEN1GAAESR1ESR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 83 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250189895-A1 | METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-06-12 | — | — | US | disclosed |
| US-20250172872-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-05-29 | — | — | US | disclosed |
| EP-3961676-B1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2025-01-22 | — | — | EP | disclosed |
| US-20240053680-A1 | PHOTOSENSITIVE DRY FILM, LAMINATED FILM, METHOD FOR PRODUCING LAMINATED FILM, AND METHOD FOR PRODUCING PATTERNED RESIST FILM | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-15 | — | — | US | disclosed |
| US-11803122-B2 | Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-31 | — | — | US | disclosed |
| US-11754926-B2 | Method of forming resist pattern, resist composition and method of producing the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-09-12 | — | — | US | disclosed |
| US-20230273521-A1 | CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-31 | — | — | US | disclosed |
| US-20230229084-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-07-20 | — | — | US | disclosed |
| EP-3702387-B1 | PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-10 | — | — | EP | disclosed |
| US-20230106185-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, AND ACID DIFFUSION SUPPRESSING AGENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-04-06 | — | — | US | disclosed |
| US-7754416-B2 | laminating support having upper surface on which copper exists, inorganic substance layer, and photoresist layer consisting of chemically amplified type positive photoresist composition to obtain photoresist laminate, selectively irradiating active light or radioactive rays to photoresist to form pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-07-13 | — | — | US | disclosed |
| US-20090226850-A1 | PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-09-10 | — | — | US | disclosed |
| EP-1817634-B1 | PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN | TOKYO OHKA KOGYO CO LTD (JP) | 2009-04-08 | — | — | EP | disclosed |
| US-20080311512-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PATTERN FORMING | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-12-18 | — | — | US | disclosed |
| EP-1825331-B1 | PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN | TOKYO OHKA KOGYO CO LTD (JP) | 2008-07-02 | — | — | EP | disclosed |
| US-20080131819-A1 | Process For Producing Resist Pattern and Conductor Pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-06-05 | — | — | US | disclosed |
| EP-1825331-A2 | PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-08-29 | — | — | EP | disclosed |
| EP-1817634-A1 | PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-08-15 | — | — | EP | disclosed |
| WO-2006059757-A2 | PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-08 | — | — | WO | disclosed |
| WO-2006059747-A1 | PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-08 | — | — | WO | disclosed |