SCHEMBL9101328

SCHEMBL9101328

CCCC(C[Si](CC(CCC)C1CCO1)(CC(CCC)C1CCO1)OC)C1CCO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27922214 0.77
SCHEMBL3382037 0.76 ALDH1A1 (0.32)
SCHEMBL3382061 0.74 SMN1; SMN2 (0.33)
SCHEMBL3377268 0.73 SMN1; SMN2 (0.36)
SCHEMBL1011877 0.72 EPHX1 (0.31)
SCHEMBL10322877 0.70
SCHEMBL9103504 0.70
SCHEMBL9101310 0.69
SCHEMBL15104973 0.69
SCHEMBL15695053 0.68 ALDH1A1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10591816-B2 Photosensitive resin composition, color filter, and liquid crystal display element thereof CHI MEI CORPORATION (TW) 2020-03-17 US disclosed
US-10162260-B2 Photosensitive resin composition, protective film, and liquid crystal display element CHI MEI CORPORATION (TW) 2018-12-25 US disclosed
US-20170235224-A1 PHOTOSENSITIVE RESIN COMPOSITION, COLOR FILTER, AND LIQUID CRYSTAL DISPLAY ELEMENT THEREOF CHI MEI CORPORATION (TW) 2017-08-17 US disclosed
US-20170168390-A1 PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT CHI MEI CORPORATION (TW) 2017-06-15 US disclosed
US-9541832-B2 Photosensitive resin composition, protective film and element having the same CHI MEI CORPORATION (TW) 2017-01-10 US disclosed
US-9507261-B2 Photosensitive composition, protective film, and element having the protective film CHI MEI CORPORATION (TW) 2016-11-29 US disclosed
US-20160291470-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTING FILM, AND ELEMENT HAVING PROTECTIVE FILM CHI MEI CORPORATION (TW) 2016-10-06 US disclosed
US-9395627-B2 Positive photosensitive resin composition and method for forming pattern by using the same CHI MEI CORPORATION 2016-07-19 US disclosed
US-9389509-B2 Photosensitive polysiloxane composition, protecting film and element having the protecting film CHI MEI CORPORATION (TW) 2016-07-12 US disclosed
US-20160179004-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTING FILM, AND ELEMENT HAVING PROTECTIVE FILM CHI MEI CORPORATION (TW) 2016-06-23 US disclosed
US-8722755-B2 Photosensitive resin composition and uses thereof CHI MEI CORPORATION (TW) 2014-05-13 US disclosed
US-20130310497-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2013-11-21 US disclosed
US-20130299755-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR A COLOR FILTER AND USES THEREOF CHI MEI CORPORATION (TW) 2013-11-14 US disclosed
US-20130280541-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2013-10-24 US disclosed
US-20130260108-A1 PHOTO-CURING POLYSILOXAN COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2013-10-03 US disclosed
US-8546061-B2 Photo-curing polysiloxane composition and protective film formed from the same CHI MEI CORPORATION (TW) 2013-10-01 US disclosed
US-20130245150-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2013-09-19 US disclosed
US-20130142966-A1 BLUE PHOTOSENSITIVE RESIN COMPOSITION FOR COLOR FILTERS AND USES THEREOF CHI MEI CORPORATION (TW) 2013-06-06 US disclosed
US-20130144005-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2013-06-06 US disclosed
US-20120141936-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND PROTECTIVE FILM FORMED FROM THE SAME CHI MEI CORPORATION (TW) 2012-06-07 US disclosed