⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10322877 | 0.86 | — | — | |
| SCHEMBL15375792 | 0.82 | — | — | |
| SCHEMBL28010936 | 0.74 | — | — | |
| SCHEMBL3381875 | 0.74 | SMN1; SMN2 (0.31) | — | |
| SCHEMBL3379499 | 0.73 | SMN1; SMN2 (0.33) | — | |
| SCHEMBL27922136 | 0.72 | — | — | |
| SCHEMBL1011271 | 0.72 | SHBG (0.30) | — | |
| SCHEMBL13719266 | 0.72 | — | — | |
| SCHEMBL11727894 | 0.71 | EPHX1 (0.44) | — | |
| SCHEMBL9101328 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10591816-B2 | Photosensitive resin composition, color filter, and liquid crystal display element thereof | CHI MEI CORPORATION (TW) | 2020-03-17 | — | — | US | disclosed |
| US-10162260-B2 | Photosensitive resin composition, protective film, and liquid crystal display element | CHI MEI CORPORATION (TW) | 2018-12-25 | — | — | US | disclosed |
| US-9851638-B2 | Photosensitive polysiloxane composition and uses thereof | CHI MEI CORPORATION (TW) | 2017-12-26 | — | — | US | disclosed |
| US-20170235224-A1 | PHOTOSENSITIVE RESIN COMPOSITION, COLOR FILTER, AND LIQUID CRYSTAL DISPLAY ELEMENT THEREOF | CHI MEI CORPORATION (TW) | 2017-08-17 | — | — | US | disclosed |
| US-20170168390-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT | CHI MEI CORPORATION (TW) | 2017-06-15 | — | — | US | disclosed |
| US-20170023860-A1 | PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF | CHI MEI CORP (TW) | 2017-01-26 | — | — | US | disclosed |
| US-9541832-B2 | Photosensitive resin composition, protective film and element having the same | CHI MEI CORPORATION (TW) | 2017-01-10 | — | — | US | disclosed |
| US-9507261-B2 | Photosensitive composition, protective film, and element having the protective film | CHI MEI CORPORATION (TW) | 2016-11-29 | — | — | US | disclosed |
| US-20160291470-A1 | PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTING FILM, AND ELEMENT HAVING PROTECTIVE FILM | CHI MEI CORPORATION (TW) | 2016-10-06 | — | — | US | disclosed |
| US-9395627-B2 | Positive photosensitive resin composition and method for forming pattern by using the same | CHI MEI CORPORATION | 2016-07-19 | — | — | US | disclosed |
| US-20130280541-A1 | PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF | CHI MEI CORPORATION (TW) | 2013-10-24 | — | — | US | disclosed |
| US-20130277627-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATIONS OF THE SAME | CHI MEI CORPORATION (TW) | 2013-10-24 | — | — | US | disclosed |
| US-20130260108-A1 | PHOTO-CURING POLYSILOXAN COMPOSITION AND APPLICATIONS THEREOF | CHI MEI CORPORATION (TW) | 2013-10-03 | — | — | US | disclosed |
| US-8546061-B2 | Photo-curing polysiloxane composition and protective film formed from the same | CHI MEI CORPORATION (TW) | 2013-10-01 | — | — | US | disclosed |
| US-20130245150-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF | CHI MEI CORPORATION (TW) | 2013-09-19 | — | — | US | disclosed |
| US-20130228727-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION OF THE SAME | CHI MEI CORPORATION (TW) | 2013-09-05 | — | — | US | disclosed |
| US-20130144005-A1 | PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF | CHI MEI CORPORATION (TW) | 2013-06-06 | — | — | US | disclosed |
| US-20130142966-A1 | BLUE PHOTOSENSITIVE RESIN COMPOSITION FOR COLOR FILTERS AND USES THEREOF | CHI MEI CORPORATION (TW) | 2013-06-06 | — | — | US | disclosed |
| US-20130135763-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION OF THE SAME | CHI MEI CORPORATION (TW) | 2013-05-30 | — | — | US | disclosed |
| US-20120141936-A1 | PHOTO-CURING POLYSILOXANE COMPOSITION AND PROTECTIVE FILM FORMED FROM THE SAME | CHI MEI CORPORATION (TW) | 2012-06-07 | — | — | US | disclosed |