SCHEMBL9104673

SCHEMBL9104673

CCCCOC(CC[Si](OC)(OC)OC)C1CCO1

nearest known ligand 0.33

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.33
LMNA P02545 1/20 0.30
EPHX1 P07099 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9101556 0.87 SMN1; SMN2 (0.32) SMN1; SMN2
SCHEMBL9101812 0.80 LTA4H (0.35) SMN1; SMN2LMNA
SCHEMBL15239861 0.73
SCHEMBL10322877 0.72
SCHEMBL28010945 0.70 SMN1; SMN2 (0.33) SMN1; SMN2EPHX1
SCHEMBL1526868 0.69
SCHEMBL3382030 0.68 EPHX1 (0.39) SMN1; SMN2EPHX1
SCHEMBL14954562 0.67
SCHEMBL9104681 0.67
SCHEMBL3379488 0.66 EPHX1 (0.42) SMN1; SMN2EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 80 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107885034-B Negative white photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-03-07 CN disclosed
CN-105319852-B Photosensitive resin composition, protective film and element with protective film 奇美实业股份有限公司 2020-06-26 CN disclosed
CN-106909028-B Photosensitive resin composition, protective film and liquid crystal display element 奇美实业股份有限公司 2020-06-05 CN disclosed
US-10591816-B2 Photosensitive resin composition, color filter, and liquid crystal display element thereof CHI MEI CORPORATION (TW) 2020-03-17 US disclosed
CN-104950580-B Photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2020-01-03 CN disclosed
CN-110320755-A Minus white photosensitive resin composition and its application 奇美实业股份有限公司 2019-10-11 CN disclosed
CN-105093832-B Photosensitive composition, protective film and element having protective film 奇美实业股份有限公司 2019-08-30 CN disclosed
CN-104423170-B Photosensitive polysiloxane composition, protective film and assembly with protective film 奇美实业股份有限公司 2019-05-24 CN disclosed
CN-104345567-B photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2019-04-02 CN disclosed
CN-109116681-A Chemically amplified positive photosensitive resin composition, photoresist pattern and method for forming the same, and electronic device 奇美实业股份有限公司 2019-01-01 CN disclosed
CN-103376661-A Photocurable polysiloxane composition, protective film and element having protective film CHI MEI COR 2013-10-30 CN disclosed
US-20130277627-A1 PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATIONS OF THE SAME CHI MEI CORPORATION (TW) 2013-10-24 US disclosed
US-20130280541-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2013-10-24 US disclosed
US-20130260108-A1 PHOTO-CURING POLYSILOXAN COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2013-10-03 US disclosed
US-8546061-B2 Photo-curing polysiloxane composition and protective film formed from the same CHI MEI CORPORATION (TW) 2013-10-01 US disclosed
US-20130245150-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2013-09-19 US disclosed
US-20130228727-A1 PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION OF THE SAME CHI MEI CORPORATION (TW) 2013-09-05 US disclosed
US-20130142966-A1 BLUE PHOTOSENSITIVE RESIN COMPOSITION FOR COLOR FILTERS AND USES THEREOF CHI MEI CORPORATION (TW) 2013-06-06 US disclosed
US-20130135763-A1 PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION OF THE SAME CHI MEI CORPORATION (TW) 2013-05-30 US disclosed
US-20120141936-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND PROTECTIVE FILM FORMED FROM THE SAME CHI MEI CORPORATION (TW) 2012-06-07 US disclosed