Hydrochloric Acid

Hydrochloric Acid

SCHEMBL9163403

CCC(C)=CC(C)=O.[Cl-].[Cl-].[Pd+2]

nearest known ligand 0.40

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.40
TDP1 Q9NUW8 2/20 0.40
FFAR3 O14843 1/20 0.33
TSHR P16473 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8649598 0.94
SCHEMBL12640274 0.94
SCHEMBL8649600 0.94
SCHEMBL27799178 0.77 ALDH1A1 (0.53) ALDH1A1TDP1FFAR3TSHR
SCHEMBL265140 0.74
SCHEMBL6748107 0.74
SCHEMBL273329 0.74
SCHEMBL3143411 0.74
SCHEMBL19599277 0.74
SCHEMBL3604562 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0562393-B1 Process for improving the adhesion of electrolessly deposited metal coatings BAYER AG (DE) 1995-11-08 EP disclosed
EP-0485839-B1 Primer for metallization BAYER AG (DE) 1995-01-04 EP disclosed
EP-0562395-A1 Magnetic recording system for the fabrication of computer hard discs BAYER AG (DE) 1993-09-29 EP disclosed
EP-0562393-A1 Process for improving the adhesion of electrolessly deposited metal coatings BAYER AG (DE) 1993-09-29 EP disclosed
EP-0255012-B1 PROCESS FOR MODIFYING THE ADHESION OF ELECTROLESS METAL COATINGS OR PLASTIC MATERIALS BAYER AG (DE) 1993-03-24 EP disclosed
US-5182135-A Treatment with organopalladium activator, polyurethane elastomer, filler, solvent BAYER AKTIENGESELLSCHAFT (DE) 1993-01-26 US disclosed
EP-0256395-B1 PROCESS FOR IMPROVING THE ADHESION OF ELECTROLESS METAL LAYERS ON PLASTIC SURFACES BAYER AG (DE) 1992-07-01 EP disclosed
EP-0485839-A2 Primer for metallization BAYER AG (DE) 1992-05-20 EP disclosed
EP-0322641-B1 PROCESS FOR IMPROVING THE ADHESION OF ELECTROLESSLY PLATED METAL LAYERS TO POLYIMIDE SURFACES BAYER AG (DE) 1992-05-20 EP disclosed
US-4910045-A Process for improving the adhesive strength of electrolessly deposited metal layers on polyimide surfaces BAYER AKTIENGESELLSCHAFT (DE) 1990-03-20 US disclosed
EP-0322641-A2 Process for improving the adhesion of electrolessly plated metal layers to polyimide surfaces BAYER AG (DE) 1989-07-05 EP disclosed
EP-0256395-A2 Process for improving the adhesion of electroless metal layers on plastic surfaces BAYER AG (DE) 1988-02-24 EP disclosed
EP-0255012-A2 Process for modifying the adhesion of electroless metal coatings or plastic materials BAYER AG (DE) 1988-02-03 EP disclosed