SCHEMBL916378

SCHEMBL916378

CC(C)(C)C(C)(C)OOOC(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9247075 0.84 ALDH1A1 (0.32)
SCHEMBL916377 0.82
SCHEMBL1899004 0.79 TSHR (0.40)
SCHEMBL28545229 0.78
Propane SCHEMBL2296352 0.73 TSHR (0.36)
SCHEMBL22733774 0.72 TSHR (0.39)
SCHEMBL19178774 0.72 MMP8 (0.33)
SCHEMBL21433591 0.71
SCHEMBL916380 0.71 TSHR (0.36)
SCHEMBL8506332 0.71 TSHR (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122070342-A Antifouling coating composition 日东化成株式会社 2026-05-19 CN disclosed
CN-117279962-B Maleimide resin, curable resin composition, and cured product thereof 日本化药株式会社 2024-11-01 CN disclosed
CN-118725390-A Expandable methyl methacrylate resin particles, methyl methacrylate resin expanded particles, methyl methacrylate expanded molded article, and lost foam 株式会社钟化 2024-10-01 CN disclosed
CN-117279962-A Maleimide resin, curable resin composition, and cured product thereof 日本化药株式会社 2023-12-22 CN disclosed
CN-117157350-A Encapsulant composition for optical device and encapsulant film for optical device using same 株式会社LG化学 2023-12-01 CN disclosed
CN-117120560-A Antifouling coating composition 日东化成株式会社 2023-11-24 CN disclosed
CN-116547324-A Glutarimide resin 株式会社钟化 2023-08-04 CN disclosed
CN-116507649-A Glutarimide resin 株式会社钟化 2023-07-28 CN disclosed
CN-112996662-B Multilayer structure and use thereof 耐克创新有限合伙公司 2023-05-23 CN disclosed
CN-112625162-B Composition for sealing material film containing ethylene/alpha-olefin copolymer and sealing material film containing same 株式会社LG化学 2022-12-16 CN disclosed
CN-112625162-A Composition for sealing material film containing ethylene/alpha-olefin copolymer and sealing material film containing same 株式会社LG化学 2021-04-09 CN disclosed
US-8524033-B2 Coated wood composite and production method thereof YAMAHA FINE TECHNOLOGIES CO., LTD. (JP) 2013-09-03 US disclosed
US-20110079353-A1 COATED WOOD COMPOSITE AND PRODUCTION METHOD THEREOF YAMAHA FINE TECHNOLOGIES CO., LTD. (JP) 2011-04-07 US disclosed
US-7867622-B2 Coated wood composite and production method thereof YAMAHA FINE TECHNOLOGIES CO., LTD. (JP) 2011-01-11 US disclosed
US-20070029042-A1 COATED WOOD COMPOSITE AND PRODUCTION METHOD THEREOF YAMAHA CORPORATION (JP) 2007-02-08 US disclosed
EP-1159343-B1 Process for making conductive molding compositions ASHLAND INC (US) 2005-12-21 EP disclosed
US-6814891-B1 THERMOPLASTIC ADDITIVES COMPRISING CONDUCTIVE CARBON BLACK WHICH CAN IMPART ELECTRICAL CONDUCTIVITY TO ARTICLES MOLDED FROM THE MOLDING COMPOSITIONS UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION 2004-11-09 US disclosed
EP-1159343-A1 CONDUCTIVE MOLDING COMPOSITIONS AND ARTICLES MOLDED THEREFROM UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 2001-12-05 EP disclosed
WO-2000049076-A1 CONDUCTIVE MOLDING COMPOSITIONS AND ARTICLES MOLDED THEREFROM UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 2000-08-24 WO disclosed