⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10719390 | 0.90 | EPHX1 (0.39) | — | |
| SCHEMBL10071381 | 0.80 | EPHX1 (0.41) | — | |
| SCHEMBL21716748 | 0.80 | — | — | |
| SCHEMBL1978276 | 0.80 | EPHX1 (0.50) | — | |
| SCHEMBL14087631 | 0.79 | KCNA4 (0.31) | — | |
| SCHEMBL2623186 | 0.79 | EPHX1 (0.39) | — | |
| SCHEMBL12396788 | 0.79 | EPHX1 (0.34) | — | |
| SCHEMBL3748115 | 0.77 | — | — | |
| SCHEMBL9077720 | 0.77 | — | — | |
| SCHEMBL2623189 | 0.77 | EPHX1 (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1121 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119735808-A | Bismaleimide resin composition, prepreg prepared from bismaleimide resin composition and laminated board prepared from bismaleimide resin composition | 睿龙材料科技(江苏)有限公司 | 2025-04-01 | — | — | CN | claimed |
| EP-2609097-A1 | PYRIDYL-AMINE FUSED AZADECALIN MODULATORS | Corcept Therapeutics, Inc. (US) | 2013-07-03 | — | — | EP | claimed |
| WO-2012027702-A1 | PYRIDYL-AMINE FUSED AZADECALIN MODULATORS | CORCEPT THERAPEUTICS, INC. (US) | 2012-03-01 | — | — | WO | claimed |
| US-20060194065-A1 | Functional polymers via surface modifying agents, and methods for polymeric surface modification | THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY | 2006-08-31 | — | — | US | claimed |
| EP-3438146-B1 | CYANIC ACID ESTER COMPOUND AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION, CURED ARTICLE, PREPREG, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE AGENT, METAL FOIL-CLAD LAMINATE PLATE, RESIN SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL CO (JP) | 2026-04-08 | — | — | EP | disclosed |
| US-20260047004-A1 | METHOD FOR PRODUCING METAL FOIL-CLAD LAMINATE, RESIN COMPOSITION, RESIN COMPOSITE SHEET, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2026-02-12 | — | — | US | disclosed |
| US-12534617-B2 | Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-01-27 | — | — | US | disclosed |
| US-12516139-B2 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-01-06 | — | — | US | disclosed |
| EP-3845575-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-12486371-B2 | Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2025-12-02 | — | — | US | disclosed |
| EP-4610287-A1 | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-09-03 | — | — | EP | disclosed |
| EP-4610285-A1 | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-09-03 | — | — | EP | disclosed |
| US-20020068237-A1 | Negative photosensitive resin composition, negative photosensitive dry film and method of forming pattern | KANSAI PAINT CO., LTD. (JP) | 2002-06-06 | — | — | US | disclosed |
| EP-1201638-A1 | PHOTOCURABLE COMPOSITION CONTAINING IODONIUM SALT COMPOUND | NIPPON SODA CO., LTD. (JP) | 2002-05-02 | — | — | EP | disclosed |
| US-6313188-B1 | USED AS CATALYSTS FOR CATIONIC PHOTOPOLYMERIZATION | NIPPON SODA CO., LTD. (JP) | 2001-11-06 | — | — | US | disclosed |
| EP-1106639-A1 | PHOTOCURABLE COMPOSITION CONTAINING IODONIUM SALT COMPOUND | NIPPON SODA CO., LTD. (JP) | 2001-06-13 | — | — | EP | disclosed |
| US-6140025-A | Negative type photosensitive resin composition and method for forming resist pattern | KANSAI PAINT CO., LTD. (JP) | 2000-10-31 | — | — | US | disclosed |
| US-6106999-A | SENSITIVITY TO GENERAL-PURPOSE VISIBLE LIGHT LASER, SO THAT HIGH-SPEED SCANNING EXPOSURE IS POSSIBLE BY LASER, AND EXTREMELY FINE HIGH RESOLUTION CAN BE OBTAINED; CAN BE USED FOR COATING OR PRINTING UNDER SAFELIGHT IRRADIATING CONDITIONS | MITSUI CHEMICALS (JP) | 2000-08-22 | — | — | US | disclosed |
| EP-0927726-A1 | PHOTOCATALYTIC COMPOSITION | NIPPON SODA CO., LTD. (JP) | 1999-07-07 | — | — | EP | disclosed |
| WO-1997003105-A1 | PREPARATION OF CYCLIC OLIGOMERS OF SUBSTITUTED CYCLIC ETHERS | THE SECRETARY OF STATE FOR DEFENCE (GB) | 1997-01-30 | — | — | WO | disclosed |