SCHEMBL9170804

SCHEMBL9170804

O=[N+]([O-])c1ccc(C=Cc2ccc(C=Cc3ccc([N+](=O)[O-])cc3)cc2)cc1

nearest known ligand 0.78

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
APP P05067 2/20 0.78
RAB9A P51151 3/20 0.76
MAPT P10636 3/20 0.76
NPC1 O15118 2/20 0.76
FBP1 P09467 2/20 0.75
PTGS2 P35354 6/20 0.70
PTGS1 P23219 2/20 0.70
CYP19A1 P11511 2/20 0.70
BCHE P06276 1/20 0.56
MAOB P27338 1/20 0.56
MEN1 O00255 2/20 0.56
KMT2A Q03164 2/20 0.56
SMN1; SMN2 Q16637 2/20 0.56
MAPK1 P28482 1/20 0.56
HTT P42858 1/20 0.56
GALK1 P51570 1/20 0.56
NFE2L2 Q16236 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL458178 1.00 APP (0.78) APPRAB9AMAPTNPC1FBP1
SCHEMBL9170800 1.00 APP (0.78) APPRAB9AMAPTNPC1FBP1
SCHEMBL14947048 1.00 APP (0.78) APPRAB9AMAPTNPC1FBP1
SCHEMBL458177 1.00 APP (0.78) APPRAB9AMAPTNPC1FBP1
SCHEMBL11375992 0.93 APP (0.69) APPRAB9AMAPTNPC1FBP1
SCHEMBL11375977 0.93 APP (0.69) APPRAB9AMAPTNPC1FBP1
SCHEMBL5514209 0.91 APP (0.67) APPRAB9AMAPTNPC1FBP1
SCHEMBL1405433 0.91 CYP19A1 (0.72) APPRAB9AMAPTNPC1FBP1
SCHEMBL5514207 0.91 APP (0.67) APPRAB9AMAPTNPC1FBP1
SCHEMBL1405432 0.91 CYP19A1 (0.72) APPRAB9AMAPTNPC1FBP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111732929-B Cyanate ester adhesive with low curing temperature and high thermal stability and preparation method thereof 遂宁立讯精密工业有限公司 2022-04-12 CN claimed
CN-111732929-B Cyanate ester adhesive with low curing temperature and high thermal stability and preparation method thereof 遂宁立讯精密工业有限公司 2022-04-12 CN disclosed
CN-111732929-B Cyanate ester adhesive with low curing temperature and high thermal stability and preparation method thereof 遂宁立讯精密工业有限公司 2022-04-12 CN disclosed
EP-0373582-B1 Electroluminescence device IDEMITSU KOSAN CO (JP) 1995-03-01 EP disclosed
US-5121029-A Displays high brightness by applying low voltage IDEMITSU KOSAN CO., LTD. (JP) 1992-06-09 US disclosed
EP-0373582-A1 Electroluminescence device IDEMITSU KOSAN COMPANY LIMITED (JP) 1990-06-20 EP disclosed
US-4529556-A Aryl substituted with hydroxy, epoxy or glycidyl groups THE DOW CHEMICAL COMPANY (US) 1985-07-16 US disclosed
US-4272598-A STYRYL DYES RICOH CO., LTD. (JP) 1981-06-09 US disclosed
US-4242260-A ELECTROGRAPHY; PHOTOCONDUCTIVITY RICOH COMPANY, LTD. (JP) 1980-12-30 US disclosed