SCHEMBL92304

SCHEMBL92304

CC(C)OC1CCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL92328 0.97 SHBG (0.36)
SCHEMBL29255934 0.97 SHBG (0.36)
SCHEMBL105827 0.97 SHBG (0.36)
SCHEMBL4018245 0.94
SCHEMBL19773990 0.91 DEGS1 (0.33)
SCHEMBL4546673 0.87
SCHEMBL10121187 0.87 DEGS1 (0.36)
SCHEMBL74849 0.87 DEGS1 (0.36)
Ammonia Solution, Strong SCHEMBL8076876 0.84
SCHEMBL10956095 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1431 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12631966-B2 Method for forming photoresist patterns SAMSUNG SDI CO., LTD. (KR) 2026-05-19 US claimed
US-12590221-B2 Resist topcoat composition, and method of forming patterns using the composition SAMSUNG SDI CO., LTD. (KR) 2026-03-31 US claimed
US-12554199-B2 Resist topcoat composition, and method of forming patterns using the composition SAMSUNG SDI CO., LTD. (KR) 2026-02-17 US claimed
US-20230026721-A1 RESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION SAMSUNG SDI CO., LTD. (KR) 2023-01-26 US claimed
US-20230026579-A1 METHOD FOR FORMING PHOTORESIST PATTERNS SAMSUNG SDI CO., LTD. (KR) 2023-01-26 US claimed
US-20230021469-A1 RESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-01-26 US claimed
US-20230028244-A1 RESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION SAMSUNG SDI CO., LTD. (KR) 2023-01-26 US claimed
US-20230024422-A1 RESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION SAMSUNG SDI CO., LTD. (KR) 2023-01-26 US claimed
US-11127974-B2 Method of preparing sulfide-based solid electrolyte, sulfide-based solid electrolyte prepared therefrom, and solid secondary battery including the sulfide electrolyte SAMSUNG ELECTRONICS CO., LTD. (KR) 2021-09-21 US claimed
US-10562991-B2 Developer, pattern forming method, and electronic device manufacturing method FUJIFILM CORPORATION (JP) 2020-02-18 US claimed
US-20190348707-A1 METHOD OF PREPARING SULFIDE-BASED SOLID ELECTROLYTE, SULFIDE-BASED SOLID ELECTROLYTE PREPARED THEREFROM, AND SOLID SECONDARY BATTERY INCLUDING THE SULFIDE ELECTROLYTE SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-11-14 US claimed
US-12631966-B2 Method for forming photoresist patterns SAMSUNG SDI CO., LTD. (KR) 2026-05-19 US disclosed
US-12624318-B2 Cleaning agent composition and cleaning method NISSAN CHEMICAL CORPORATION (JP) 2026-05-12 US disclosed
US-12590221-B2 Resist topcoat composition, and method of forming patterns using the composition SAMSUNG SDI CO., LTD. (KR) 2026-03-31 US disclosed
US-20260071152-A1 CLEANING METHOD NISSAN CHEMICAL CORPORATION (JP) 2026-03-12 US disclosed
EP-0232776-B1 2,5,6,7-TETRANOR-4,8-INTER-M-PHENYLENE PGI2 DERIVATIVES TORAY INDUSTRIES, INC. (JP) 1990-10-24 EP disclosed
EP-0389162-A1 2,5,6,7-Tetranor-4,8-inter-m-phenylene PGI2 derivatives TORAY INDUSTRIES, INC. (JP) 1990-09-26 EP disclosed
US-4775692-A ANTILIPEMIC, ANTICOAGULANT, HYPOTENSIVE, ANTISECRETORY AND ANTIULCER AGENT TORAY INDUSTRIES, INC. (JP) 1988-10-04 US disclosed
EP-0284005-A2 Method of production of polyolefins IDEMITSU PETROCHEMICAL CO. LTD. (JP) 1988-09-28 EP disclosed
EP-0232776-A2 2,5,6,7-tetranor-4,8-inter-m-phenylene PGI2 derivatives TORAY INDUSTRIES, INC. (JP) 1987-08-19 EP disclosed