⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11476490 | 0.77 | — | — | |
| SCHEMBL9494797 | 0.76 | ALDH1A1 (0.36) | — | |
| SCHEMBL28590644 | 0.76 | — | — | |
| Methacrylic Acid SCHEMBL1648981 | 0.74 | ALDH1A1 (0.40) | — | |
| SCHEMBL92114 | 0.74 | — | — | |
| SCHEMBL13817390 | 0.74 | TSHR (0.52) | — | |
| SCHEMBL6356847 | 0.74 | — | — | |
| SCHEMBL8436925 | 0.74 | ALDH1A1 (0.35) | — | |
| SCHEMBL29121045 | 0.74 | ALDH1A1 (0.35) | — | |
| SCHEMBL10629461 | 0.74 | ALDH1A1 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20170075218-A1 | RESIST COMPOSITION AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-03-16 | — | — | US | disclosed |
| US-20160018571-A1 | COMPOSITION FOR LIGHT DIFFUSION FILM, AND LIGHT DIFFUSION FILM | LINTEC CORPORATION (JP) | 2016-01-21 | — | — | US | disclosed |
| US-8129086-B2 | Polymerizable compound, polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-03-06 | — | — | US | disclosed |
| US-8129086-B2 | Polymerizable compound, polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-03-06 | — | — | US | disclosed |
| US-8101341-B2 | Patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-01-24 | — | — | US | disclosed |
| US-8101341-B2 | Patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-01-24 | — | — | US | disclosed |
| US-20100178617-A1 | PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| US-20100178617-A1 | PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| US-20090297979-A1 | Polymerizable compound, polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20090297979-A1 | Polymerizable compound, polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |
| EP-1932861-A1 | AMORPHOUS THERMOPLASTIC RESIN AND EXTRUDED FILM OR SHEET | Nippon Shokubai Co., Ltd. (JP) | 2008-06-18 | — | — | EP | disclosed |
| US-6974658-B2 | HIGH MOLECULAR COMPOUND, MONOMER COMPOUNDS AND PHOTOSENSITIVE COMPOSITION FOR PHOTORESIST, PATTERN FORMING METHOD UTILIZING PHOTOSENSITIVE COMPOSITION, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENTS | KABUSHIKI KAISHA TOSHIBA (JP) | 2005-12-13 | — | — | US | disclosed |
| US-20030235781-A1 | High molecular compound, monomer compounds and photosensitive composition for photoresist, pattern forming method utilizing photosensitive composition, and method of manufacturing electronic components | KABUSHIKI KAISHA TOSHIBA (JP) | 2003-12-25 | — | — | US | disclosed |