SCHEMBL9234841

SCHEMBL9234841

Nc1cccc(S(=O)(=O)c2cccc(Oc3cccc(S(=O)(=O)c4cccc(N)c4)c3)c2)c1

nearest known ligand 0.74

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.74
CA2 P00918 3/20 0.55
CA12 O43570 2/20 0.55
CA1 P00915 2/20 0.55
CA4 P22748 2/20 0.55
CA9 Q16790 2/20 0.55
MAOB P27338 1/20 0.55
CA14 Q9ULX7 1/20 0.55
ALDH1A1 P00352 4/20 0.53
TDP1 Q9NUW8 2/20 0.53
TSHR P16473 1/20 0.53
HSD17B10 Q99714 1/20 0.53
MAPT P10636 2/20 0.47
SMN1; SMN2 Q16637 2/20 0.47
MEN1 O00255 1/20 0.47
MITF O75030 1/20 0.47
GAA P10253 1/20 0.47
GFER P55789 1/20 0.47
KMT2A Q03164 1/20 0.47
NLRP1 Q9C000 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29466929 0.96 LMNA (0.68) LMNACA2CA12CA1CA4
SCHEMBL311488 0.96 LMNA (0.68) LMNACA2CA12CA1CA4
SCHEMBL8802752 0.96 LMNA (0.68) LMNACA2CA12CA1CA4
SCHEMBL28717130 0.91 MAOB (0.65) LMNACA2CA12CA1CA4
SCHEMBL29466930 0.87 ALDH1A1 (0.66) LMNAMAOBALDH1A1TDP1TSHR
SCHEMBL10491259 0.87 ALDH1A1 (0.66) LMNAMAOBALDH1A1TDP1TSHR
SCHEMBL9155427 0.87 LMNA (0.71) LMNACA2CA12CA1CA4
SCHEMBL139680 0.87 ALDH1A1 (0.66) LMNAMAOBALDH1A1TDP1TSHR
SCHEMBL1305704 0.87 ALDH1A1 (0.56) LMNAMAOBALDH1A1TDP1TSHR
SCHEMBL34546 0.86 LMNA (1.00) LMNACA2CA12CA1CA4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0553612-B1 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO LTD (JP) 1996-08-21 EP disclosed
US-5510425-A AROMATIC POLYIMIDE-EPOXY COPOLYMER MODIFIED BY BISMALEIMIDE COMPOUND; FLEXIBILITY, PEELING STRENGTH; COLDSETTING RESINS, ADHESIVES HITACHI CHEMICAL COMPANY, LTD. (JP) 1996-04-23 US disclosed
US-5508357-A SOLUBILITY IN SOLVENT, LOW MELTING POINT HITACHI CHEMICAL COMPANY, LTD. (JP) 1996-04-16 US disclosed
EP-0553612-A2 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO., LTD. (JP) 1993-08-04 EP disclosed