SCHEMBL9258161

SCHEMBL9258161

CCC/C(=C\c1ccc(O)cc1)c1ccc(O)cc1

nearest known ligand 0.72

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 7/20 0.72
ESR2 Q92731 6/20 0.72
HSD17B3 P37058 2/20 0.50
NQO2 P16083 2/20 0.49
ALDH1A1 P00352 2/20 0.46
KDM4E B2RXH2 1/20 0.46
PTGS1 P23219 3/20 0.44
PTGS2 P35354 2/20 0.44
KMT2A Q03164 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9258167 1.00 ESR1 (0.72) ESR1ESR2HSD17B3NQO2ALDH1A1
SCHEMBL20534166 0.91 ESR1 (0.61) ESR1ESR2HSD17B3NQO2ALDH1A1
SCHEMBL20534163 0.91 ESR1 (0.61) ESR1ESR2HSD17B3NQO2ALDH1A1
SCHEMBL574346 0.84 ESR1 (1.00) ESR1ESR2NQO2ALDH1A1KDM4E
SCHEMBL9113341 0.84 ESR1 (1.00) ESR1ESR2NQO2ALDH1A1KDM4E
SCHEMBL12459964 0.82 HSD17B3 (0.55) ESR1ESR2HSD17B3ALDH1A1PTGS1
SCHEMBL10583351 0.82 HSD17B3 (0.55) ESR1ESR2HSD17B3ALDH1A1PTGS1
SCHEMBL20534184 0.81 ESR1 (0.57) ESR1ESR2HSD17B3PTGS1PTGS2
SCHEMBL20534185 0.81 ESR1 (0.57) ESR1ESR2HSD17B3PTGS1PTGS2
SCHEMBL10647869 0.79 RARB (0.50) ESR1ESR2ALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5382693-A Curing agents for epoxy resins THE DOW CHEMICAL COMPANY (US) 1995-01-17 US disclosed
WO-1994026690-A1 BIS(AMINOPHENOXY)-ALPHA-SUBSTITUTED STILBENES, CURABLE MIXTURES WITH EPOXY RESINS AND CURED PRODUCTS THE DOW CHEMICAL COMPANY (US) 1994-11-24 WO disclosed
US-5300594-A Bis(aminophenoxy)-alpha-substituted stilbenes, curable mixtures with epoxy resins and cured products THE DOW CHEMICAL COMPANY (US) 1994-04-05 US disclosed