⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL56082 | 0.71 | ALDH1A1 (0.33) | — | |
| SCHEMBL27541646 | 0.69 | — | — | |
| SCHEMBL2292719 | 0.67 | ALDH1A1 (0.30) | — | |
| SCHEMBL21309259 | 0.66 | — | — | |
| SCHEMBL11462975 | 0.64 | — | — | |
| SCHEMBL19640921 | 0.64 | — | — | |
| SCHEMBL17407240 | 0.64 | KIF11 (0.31) | — | |
| SCHEMBL759326 | 0.63 | — | — | |
| SCHEMBL28131698 | 0.63 | CA12 (0.39) | — | |
| SCHEMBL27448698 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-104209094-B | Amido carboxylic acid modifies the preparation method of meerschaum heavy metal absorbent | 中国科学院重庆绿色智能技术研究院 | 2016-08-24 | — | — | CN | claimed |
| CN-106715580-B | Resin composition for semiconductor encapsulation, semiconductor device, and structure | 住友电木株式会社 | 2019-11-26 | — | — | CN | disclosed |
| CN-110476243-A | The manufacturing method of electronic circuit protection materials, electronic circuit protection materials sealing material, encapsulating method and semiconductor device | HITACHI CHEMICAL CO LTD | 2019-11-19 | — | — | CN | disclosed |
| CN-110461938-A | Epoxy resin composition and electronic component device | HITACHI CHEMICAL CO LTD | 2019-11-15 | — | — | CN | disclosed |
| CN-110461939-A | Epoxy resin composition for sealing and electronic component device | HITACHI CHEMICAL CO LTD | 2019-11-15 | — | — | CN | disclosed |
| CN-106661324-B | Amilan polyamide resin composition and the formed products formed by it | 宇部兴产株式会社 | 2019-08-02 | — | — | CN | disclosed |
| CN-109219637-A | Sealing compositions and semiconductor device | 日立化成株式会社 | 2019-01-15 | — | — | CN | disclosed |
| CN-109071922-A | liquid epoxy resin composition for sealing and electronic component device | 日立化成株式会社 | 2018-12-21 | — | — | CN | disclosed |
| CN-109071780-A | Epoxy resin composition and electronic component device | 日立化成株式会社 | 2018-12-21 | — | — | CN | disclosed |
| CN-105524589-B | A kind of Liquid optical clear adhesive stick and preparation method thereof | 矽时代材料科技股份有限公司 | 2018-12-18 | — | — | CN | disclosed |
| CN-102844383-A | Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode | KANEKA CORP | 2012-12-26 | — | — | CN | disclosed |
| CN-101133097-B | Curing accelerator, curable resin composition, and electronic device | HITACHI CHEMICAL CO LTD | 2011-11-09 | — | — | CN | disclosed |
| CN-101668632-A | Decorative board | AICA KOGYO CO LTD | 2010-03-10 | — | — | CN | disclosed |
| CN-101522409-A | Laminate, method of forming conductive pattern, conductive pattern obtained thereby, printed wiring board, thin-layer transistor and apparatus utilizing these | FUJIFILM CORP (JP) | 2009-09-02 | — | — | CN | disclosed |
| CN-101133097-A | Curing accelerator, curable resin composition, and electronic device | HITACHI CHEMICAL CO LTD (JP) | 2008-02-27 | — | — | CN | disclosed |
| CN-101076261-A | Method of preventing or reducing off-flavor in a beverage using silane-treated silica filter media | DOW CORNING (US) | 2007-11-21 | — | — | CN | disclosed |
| CN-1997291-A | Method of preventing or reducing haze in a beverage using silane-treated silica filter media | GENENCOR INT (US) | 2007-07-11 | — | — | CN | disclosed |
| EP-0409079-B1 | A method of forming a sealant having organopolysiloxanes as a main ingredient | THREE BOND CO LTD (JP) | 1995-10-04 | — | — | EP | disclosed |
| US-5126171-A | METHOD OF FORMING A SEALANT HAVING ORGANOPOLYSILOXANES AS A MAIN INGREDIENT | THREE BOND CO., LTD. (JP) | 1992-06-30 | — | — | US | disclosed |
| EP-0409079-A2 | A method of forming a sealant having organopolysiloxanes as a main ingredient | THREE BOND CO., LTD. (JP) | 1991-01-23 | — | — | EP | disclosed |