SCHEMBL9280238

SCHEMBL9280238

CCC(N)[Si](OC(C)=O)(OC(C)=O)OC(C)=O

nearest known ligand 0.33

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33
LMNA P02545 1/20 0.33
HSD17B10 Q99714 1/20 0.33
SLC1A3 P43003 1/20 0.30
SLC1A2 P43004 1/20 0.30
SLC1A1 P43005 1/20 0.30
LAP3 P28838 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetic Acid SCHEMBL5065361 0.76 SLC1A3 (0.35) SLC1A3SLC1A2SLC1A1
SCHEMBL3214845 0.74 TSHR (0.35) ALDH1A1LMNAHSD17B10
SCHEMBL19897496 0.74 ALDH1A1 (0.35) ALDH1A1LMNAHSD17B10
SCHEMBL6390819 0.73 TSHR (0.38) ALDH1A1
SCHEMBL28098707 0.73 TSHR (0.33) ALDH1A1LMNAHSD17B10
SCHEMBL19897497 0.73 ALDH1A1 (0.33) ALDH1A1LMNAHSD17B10
SCHEMBL8677557 0.72
SCHEMBL4310063 0.72
SCHEMBL6261921 0.71 ALDH1A1 (0.32) ALDH1A1LMNAHSD17B10
Bicarbonate SCHEMBL27040893 0.71 SLC1A3 (0.33) SLC1A3SLC1A2SLC1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109679118-B Phosphate modified cationic microgel, preparation method and application 廊坊立邦涂料有限公司 2022-02-11 CN claimed
CN-109679118-A A kind of phosphate modified cationic microgel, Preparation method and use 廊坊立邦涂料有限公司 2019-04-26 CN claimed
US-12492272-B2 Modified vinyl alcohol polymer, aqueous solution, and method for producing modified vinyl alcohol polymer KURARAY CO., LTD. (JP) 2025-12-09 US disclosed
CN-116635503-B Modified vinyl alcohol polymer, method for producing modified vinyl alcohol polymer, particles, aqueous solution, coating liquid, coating material, molded article, release paper, dispersant, method for producing vinyl polymer, and mixture 株式会社可乐丽 2024-12-17 CN disclosed
CN-114450329-B Film for producing optical film, method for producing optical film, and optical film 株式会社可乐丽 2024-11-01 CN disclosed
US-20240309141-A1 MODIFIED VINYL ALCOHOL POLYMER, MODIFIED VINYL ALCOHOL POLYMER PRODUCTION METHOD, PARTICLES, AQUEOUS SOLUTION, COATING LIQUID, COATED ARTICLE, MOLDED PRODUCT, RELEASE PAPER, DISPERSANT, VINYL POLYMER PRODUCTION METHOD, AND MIXTURE KURARAY CO., LTD. (JP) 2024-09-19 US disclosed
EP-4384485-A1 CONSTRUCTION MATERIAL DRY MIXES CONTAINING SOLID VINYL ESTER RESINS Wacker Chemie AG (DE) 2024-06-19 EP disclosed
CN-116635503-A Modified vinyl alcohol polymer, method for producing modified vinyl alcohol polymer, particles, aqueous solution, coating liquid, coating material, molded article, release paper, dispersant, method for producing vinyl polymer, and mixture 株式会社可乐丽 2023-08-22 CN disclosed
US-20230242688-A1 MODIFIED VINYL ALCOHOL POLYMER, AQUEOUS SOLUTION, AND METHOD FOR PRODUCING MODIFIED VINYL ALCOHOL POLYMER KURARAY CO., LTD. (JP) 2023-08-03 US disclosed
CN-116457709-A Film for producing optical film, method for producing optical film, and optical film 株式会社可乐丽 2023-07-18 CN disclosed
CN-116438230-A Film for producing optical film and method for producing optical film 株式会社可乐丽 2023-07-14 CN disclosed
EP-3707180-A1 WATER-SOLUBLE COPOLYMERS Wacker Chemie AG (DE) 2020-09-16 EP disclosed
WO-2020007467-A1 WATER-SOLUBLE COPOLYMERS WACKER CHEMIE AG (DE) 2020-01-09 WO disclosed
US-9966463-B2 Semiconductor device and method for producing same having multilayer wiring structure with contact hole having hydrophobic film formed on side surface of the contact hole FUJITSU LIMITED (JP) 2018-05-08 US disclosed
US-20170222033-A1 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME FUJITSU LIMITED (JP) 2017-08-03 US disclosed
US-9660065-B2 Semiconductor device and method for producing same having multilayer wiring structure with contact hole having hydrophobic film formed on side surface of the contact hole FUJITSU LIMITED (JP) 2017-05-23 US disclosed
US-20150115411-A1 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME FUJITSU LIMITED (JP) 2015-04-30 US disclosed
EP-2646880-A1 TWO-COMPONENT DEVELOPER Canon Kabushiki Kaisha (JP) 2013-10-09 EP disclosed
CN-101324755-B Radiation sensitive resin composition, interlayer dielectric and microlens, and method for producing thereof JSR CORP 2012-10-03 CN disclosed
WO-2012074035-A1 TWO-COMPONENT DEVELOPER CANON KABUSHIKI KAISHA (JP) 2012-06-07 WO disclosed