SCHEMBL93131

SCHEMBL93131

[CH2]CCCCCCC[CH]C

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4643088 1.00 TSHR (0.33) TSHR
SCHEMBL93155 1.00
SCHEMBL2281821 1.00 TSHR (0.33) TSHR
SCHEMBL4641274 1.00 TSHR (0.33) TSHR
SCHEMBL4643637 1.00 TSHR (0.33) TSHR
SCHEMBL4641353 1.00 TSHR (0.33) TSHR
SCHEMBL1481861 1.00 TSHR (0.33) TSHR
SCHEMBL4641445 1.00 TSHR (0.33) TSHR
SCHEMBL2277028 1.00 TSHR (0.33) TSHR
SCHEMBL4646590 1.00 TSHR (0.33) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 225 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9205232-B2 Balloon for catheter and balloon catheter TERUMO KABUSHIKI KAISHA (JP) 2015-12-08 US claimed
US-20130085519-A1 BALLOON FOR CATHETER AND BALLOON CATHETER TERUMO KABUSHIKI KAISHA (JP) 2013-04-04 US claimed
CN-118201905-A Cationic lipid 武田药品工业株式会社 2024-06-14 CN disclosed
US-20240191030-A1 RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, MULTILAYERED PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2024-06-13 US disclosed
US-20240191009-A1 POLYFUNCTIONALIZED HIGH-CIS 1,4-POLYBUTADIENE AND METHOD FOR MANUFACTURING THE SAME KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 2024-06-13 US disclosed
US-20240174809-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYERED PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2024-05-30 US disclosed
WO-2024090408-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD 三菱瓦斯化学株式会社 2024-05-02 WO disclosed
WO-2024090409-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD 三菱瓦斯化学株式会社 2024-05-02 WO disclosed
WO-2024090410-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL-FOIL-CLAD LAMINATE BOARD, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD 三菱瓦斯化学株式会社 2024-05-02 WO disclosed
EP-4357376-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-04-24 EP disclosed
EP-4357375-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-04-24 EP disclosed
US-4892680-A OXIDATION RESISTANCE NIPPON OIL CO., LTD. (JP) 1990-01-09 US disclosed
US-4782160-A CALCIUM RECEPTOR ANTAGONISTS YAMANOUCHI PHARMACEUTICAL CO., LTD. (JP) 1988-11-01 US disclosed
EP-0285267-A2 Pyridine derivatives for treatment and prevention of liver damage, and their preparation YAMANOUCHI PHARMACEUTICAL CO. LTD. (JP) 1988-10-05 EP disclosed
EP-0276552-A1 1,4-dihydropyridine derivatives and their production YAMANOUCHI PHARMACEUTICAL CO. LTD. (JP) 1988-08-03 EP disclosed
EP-0069067-B1 TRANSPARENT POLYAMIDES, PROCESS FOR THEIR PREPARATION AND THEIR USE IN THE MANUFACTURE OF MOULDINGS CIBA-GEIGY AG (CH) 1985-03-20 EP disclosed
US-4433137-A MOLDING MATERIALS CIBA-GEIGY CORPORATION (US) 1984-02-21 US disclosed
US-4429110-A HYDROLYTICALLY STABLE MOLDING MATERIALS CIBA-GEIGY CORPORATION (US) 1984-01-31 US disclosed
EP-0084408-A1 Bicyclooctane compounds and their production and use SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1983-07-27 EP disclosed
EP-0069067-A2 Transparent polyamides, process for their preparation and their use in the manufacture of mouldings CIBA-GEIGY AG (CH) 1983-01-05 EP disclosed