SCHEMBL4643637

SCHEMBL4643637

[CH2]CCCCCCCCCCCCCCCC[CH]C

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4643088 1.00 TSHR (0.33) TSHR
SCHEMBL93155 1.00
SCHEMBL2281821 1.00 TSHR (0.33) TSHR
SCHEMBL4641274 1.00 TSHR (0.33) TSHR
SCHEMBL4641353 1.00 TSHR (0.33) TSHR
SCHEMBL1481861 1.00 TSHR (0.33) TSHR
SCHEMBL4641445 1.00 TSHR (0.33) TSHR
SCHEMBL93131 1.00 TSHR (0.33) TSHR
SCHEMBL2277028 1.00 TSHR (0.33) TSHR
SCHEMBL4646590 1.00 TSHR (0.33) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11924979-B2 Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-03-05 US disclosed
US-20230406987-A1 THERMOPLASTIC POLYURETHANE, RESIN COMPOSITION CONTAINING THE SAME, AND MOLDED PRODUCT OBTAINED THEREFROM BASE SE (DE) 2023-12-21 US disclosed
EP-4251671-A2 THERMOPLASTIC POLYURETHANE, RESIN COMPOSITION CONTAINING THE SAME, AND MOLDED PRODUCT OBTAINED THEREFROM BASF SE (DE) 2023-10-04 EP disclosed
CN-112004889-B Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device 三菱瓦斯化学株式会社 2022-12-09 CN disclosed
WO-2022112280-A2 THERMOPLASTIC POLYURETHANE, RESIN COMPOSITION CONTAINING THE SAME, AND MOLDED PRODUCT OBTAINED THEREFROM BASF SE (DE) 2022-06-02 WO disclosed
US-11185851-B2 Polymer-supported metal TAKASAGO INTERNATIONAL CORPORATION (JP) 2021-11-30 US disclosed
US-20210147629-A1 RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-05-20 US disclosed
EP-3786233-A1 RESIN COMPOSITION, LAMINATE, RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR WAFER, SUBSTRATE FOR MOUNTING RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-03-03 EP disclosed
CN-112004889-A Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device 三菱瓦斯化学株式会社 2020-11-27 CN disclosed
EP-3417939-A1 METAL-SUPPORTED MACROMOLECULE Takasago International Corporation (JP) 2018-12-26 EP disclosed
US-9611279-B2 Zinc complex TAKASAGO INTERNATIONAL CORPORATION (JP) 2017-04-04 US disclosed
US-9405187-B2 Salt, acid generator and resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2016-08-02 US disclosed
US-20160002268-A1 ZINC COMPLEX TAKASAGO INTERNATIONAL CORPORATION (JP) 2016-01-07 US disclosed
US-20110318688-A1 SALT, ACID GENERATOR AND RESIST COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2011-12-29 US disclosed
EP-1443042-B1 HYBRID ONIUM SALT WAKO PURE CHEM IND LTD (JP) 2008-08-13 EP disclosed
US-7101918-B2 Hybrid type onium salt WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2006-09-05 US disclosed
US-20050020710-A1 Hybrid onium salt WAKO PURE CHEMICALS INDUSTRIES, LTD. (JP) 2005-01-27 US disclosed
EP-1443042-A1 HYBRID ONIUM SALT Wako Pure Chemical Industries, Ltd. (JP) 2004-08-04 EP disclosed
US-4088583-A WATER, GAS, FOAMING AGENT, EROSION AND CORROSION INHIBITOR, CARBOXYALKYL CELLULOSE ETHER OR POLYALKYLENE OXIDE POLYMER UNION OIL COMPANY OF CALIFORNIA (US) 1978-05-09 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20160002268-A1 ZINC COMPLEX SLC39A11, SLC39A3, SOD1 TSHR 1458/4885
US-20110318688-A1 SALT, ACID GENERATOR AND RESIST COMPOSITION RER1, FGFR1, NHERF1 TSHR 550/4885
US-11185851-B2 Polymer-supported metal SOD1, PCNA, MAX TSHR 3411/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.