SCHEMBL29754607

SCHEMBL29754607

O=C1C=CC(=O)N1c1ccccc1Oc1ccc(Oc2ccccc2N2C(=O)C=CC2=O)cc1

nearest known ligand 0.65

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 12/20 0.65
TLR9 Q9NR96 3/20 0.59
NR1H2 P55055 1/20 0.53
FAAH O00519 1/20 0.46
ALDH1A1 P00352 2/20 0.42
HSP90AA1 P07900 1/20 0.42
PKM P14618 1/20 0.42
CCR6 P51684 1/20 0.42
ATM Q13315 1/20 0.42
NPSR1 Q6W5P4 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
G6PD P11413 1/20 0.42
HTR1A P08908 2/20 0.41
SLC6A2 P23975 2/20 0.41
SLC6A4 P31645 2/20 0.41
SLC6A3 Q01959 2/20 0.41
MAPK1 P28482 1/20 0.41
HTT P42858 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2814012 0.94 MGLL (0.62) MGLLTLR9NR1H2FAAHALDH1A1
SCHEMBL9320871 0.90 MGLL (0.71) MGLLTLR9NR1H2FAAHALDH1A1
SCHEMBL10398325 0.88 MGLL (0.69) MGLLTLR9NR1H2FAAHALDH1A1
SCHEMBL27718158 0.88 MGLL (0.56) MGLLTLR9NR1H2FAAHALDH1A1
SCHEMBL29754826 0.87 MGLL (0.55) MGLLTLR9NR1H2FAAHALDH1A1
SCHEMBL6338124 0.87 MGLL (0.55) MGLLTLR9NR1H2FAAHALDH1A1
SCHEMBL31180001 0.87 MGLL (0.59) MGLLTLR9NR1H2FAAHALDH1A1
SCHEMBL13584288 0.86 TLR9 (0.57) MGLLTLR9NR1H2ALDH1A1HSP90AA1
SCHEMBL9578160 0.85 MGLL (0.49) MGLLTLR9NR1H2FAAHALDH1A1
SCHEMBL8506269 0.85 MGLL (0.53) MGLLTLR9NR1H2FAAHNPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118772377-A Urea epoxy curing accelerator, epoxy conductive silver adhesive and preparation method 汉方新材料科技(嘉善)有限公司 2024-10-15 CN disclosed
CN-114797697-A Bismaleimide resin hollow polymer microsphere, preparation method thereof and method for modifying cyanate resin 北京化工大学 2022-07-29 CN disclosed