SCHEMBL939494

SCHEMBL939494

CO[Ti](OC)(OC(C)C)OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11900957 0.93
SCHEMBL28793496 0.90
SCHEMBL15774 0.81
SCHEMBL10903304 0.78
SCHEMBL5563567 0.77
Potassium Ion SCHEMBL9776622 0.74
Isopropyl Alcohol SCHEMBL28339044 0.71 ALDH1A1 (0.43)
SCHEMBL11707211 0.71 ADRB2 (0.31)
SCHEMBL15440437 0.69
SCHEMBL4949191 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12570771-B2 Curing catalyst used for curing of polymer, production method for said curing catalyst, mositure-curable composition, and production method for cured product NITTO KASEI CO., LTD. (JP) 2026-03-10 US disclosed
EP-4682204-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2026-01-21 EP disclosed
EP-4656672-A1 METHOD FOR PRODUCING CURABLE COMPOSITION Kaneka Corporation (JP) 2025-12-03 EP disclosed
EP-4174052-B1 CURING CATALYST USED FOR CURING OF POLYMER, PRODUCTION METHOD FOR SAID CURING CATALYST, MOISTURE-CURABLE COMPOSITION, AND PRODUCTION METHOD FOR CURED PRODUCT NITTO KASEI CO LTD (JP) 2025-11-26 EP disclosed
EP-4596622-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2025-08-06 EP disclosed
EP-4567075-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2025-06-11 EP disclosed
WO-2025111365-A1 METHOD OF PREPARING A MOISTURE CURABLE RESIN COMPOSITION WITH A NON-TIN CATALYST KANEKA AMERICAS HOLDING, INC. (US) 2025-05-30 WO disclosed
US-12312464-B2 Curing catalyst used for curing of polymer, moisture curable composition, and method for producing cured product NITTO KASEI CO., LTD. (JP) 2025-05-27 US disclosed
US-12285742-B2 Curing catalyst used for curing of polymer, production method for said curing catalyst, moisture-curable composition, and production method for cured article NITTO KASEI CO., LTD. (JP) 2025-04-29 US disclosed
EP-4067337-B1 CURING CATALYST USED FOR CURING OF POLYMER, MOISTURE CURABLE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT NITTO KASEI CO LTD (JP) 2025-04-23 EP disclosed
WO-2021106943-A1 CURING CATALYST USED FOR CURING OF POLYMER, PRODUCTION METHOD FOR SAID CURING CATALYST, MOISTURE-CURABLE COMPOSITION, AND PRODUCTION METHOD FOR CURED ARTICLE 日東化成株式会社 2021-06-03 WO disclosed
WO-2021106942-A1 CURING CATALYST USED FOR CURING OF POLYMER, MOISTURE CURABLE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT 日東化成株式会社 2021-06-03 WO disclosed
US-20180222184-A1 PIEZOELECTRIC ACTUATOR, METHOD FOR MANUFACTURING SAME, AND LIQUID DISCHARGE HEAD CANON KABUSHIKI KAISHA (JP) 2018-08-09 US disclosed
US-20170092841-A1 SUBSTRATE FOR PIEZOELECTRIC BODY FORMATION, METHOD FOR MANUFACTURING THE SAME, PIEZOELECTRIC SUBSTRATE, AND LIQUID EJECTION HEAD CANON KABUSHIKI KAISHA (JP) 2017-03-30 US disclosed
EP-2450946-B1 METHOD FOR REMOVING FERROELECTRIC CSD COATING FILM MITSUBISHI MATERIALS CORP (JP) 2017-01-18 EP disclosed
US-20150129547-A1 LIQUID AND METHOD FOR REMOVING CSD COATED FILM, FERROELECTRIC THIN FILM AND METHOD FOR PRODUCING THE SAME MITSUBISHI MATERIALS CORP (JP) 2015-05-14 US disclosed
EP-2450946-A1 FLUID FOR REMOVING COATING FILM FORMED BY CSD, METHOD FOR REMOVING CSD COATING FILM USING SAME, AND FERROELECTRIC THIN FILM AND PROCESS FOR PRODUCING SAME Mitsubishi Materials Corporation (JP) 2012-05-09 EP disclosed
US-20120100330-A1 LIQUID AND METHOD FOR REMOVING CSD COATED FILM, FERROELECTRIC THIN FILM AND METHOD FOR PRODUCING THE SAME MITSUBISHI MATERIALS CORPORATION (JP) 2012-04-26 US disclosed
US-20110020692-A1 SEPARATOR FOR METAL HALIDE BATTERY ASAHI KASEI E-MATERIALS CORPORATION (JP) 2011-01-27 US disclosed
US-20040129917-A1 Composition for forming piezoelectric film, manufacturing method of piezoelectric film, piezoelectric element and ink jet recording head CANON KABUSHIKI KAISHA (JP) 2004-07-08 US disclosed