SCHEMBL9419945

SCHEMBL9419945

C(OCC1CO1)C1CO1.Oc1ccccc1Sc1ccccc1O

nearest known ligand 0.43

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.43
ALDH1A1 P00352 3/20 0.40
GLA P06280 1/20 0.40
TSHR P16473 3/20 0.39
TP53 P04637 1/20 0.39
CYP3A4 P08684 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
HIF1A Q16665 1/20 0.39
P4HB P07237 1/20 0.37
MGLL Q99685 3/20 0.36
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
MAPK1 P28482 1/20 0.34
HSP90AA1 P07900 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Catechol SCHEMBL679936 0.86 TDP1 (0.52) TDP1ALDH1A1GLATSHRTP53
Questiomycin B SCHEMBL28007145 0.81 TSHR (0.52) TDP1ALDH1A1GLATSHRTP53
SCHEMBL394006 0.81 TDP1 (0.47) TDP1ALDH1A1GLATSHRTP53
Orthocresol SCHEMBL1287877 0.79 ALDH1A1 (0.54) TDP1ALDH1A1GLATSHRTP53
SCHEMBL2301121 0.78 HSPA5 (0.55) TDP1ALDH1A1GLATSHRTP53
2-Chlorophenol SCHEMBL8863363 0.78 ALDH1A1 (0.52) TDP1ALDH1A1GLATSHRTP53
SCHEMBL6894129 0.78 ALDH1A1 (0.49) TDP1ALDH1A1GLATSHRTP53
SCHEMBL729500 0.77 TSHR (0.46) TDP1ALDH1A1GLATSHRTP53
SCHEMBL1715945 0.77 IDO1 (0.48) TDP1ALDH1A1GLATSHRTP53
Phenol SCHEMBL33409 0.77 TDP1 (0.55) TDP1ALDH1A1GLATSHRTP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114222779-B Polyorganosiloxane containing epoxy group, curable resin composition containing the same, and cured product thereof 三菱化学株式会社 2024-06-18 CN disclosed
CN-118076485-A Laminate, epoxy film, and wound body 三菱化学株式会社 2024-05-24 CN disclosed
EP-4023694-B1 EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT OF SAME MITSUBISHI CHEM CORP (JP) 2024-02-14 EP disclosed
US-11787898-B2 Epoxy resin, epoxy resin-containing composition and cured product thereof MITSUBISHI CHEMICAL CORPORATION (JP) 2023-10-17 US disclosed
CN-110662782-B Epoxy resin, composition containing epoxy resin, and cured product thereof 三菱化学株式会社 2022-07-22 CN disclosed
EP-4023694-A1 EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT OF SAME Mitsubishi Chemical Corporation (JP) 2022-07-06 EP disclosed
US-20220153933-A1 POLYORGANOSILOXANE WITH EPOXY GROUP, CURABLE RESIN COMPOSITION CONTAINING POLYORGANOSILOXANE WITH EPOXY GROUP, AND CURED PRODUCT THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2022-05-19 US disclosed
CN-114222779-A Epoxy group-containing polyorganosiloxane, curable resin composition containing epoxy group-containing polyorganosiloxane, and cured product thereof 三菱化学株式会社 2022-03-22 CN disclosed
EP-3632951-B1 EPOXY RESIN, EPOXY RESIN-CONTAINING COMPOSITION AND CURED PRODUCT THEREOF MITSUBISHI CHEM CORP (JP) 2021-10-06 EP disclosed
CN-112694599-A Phenoxy resin, method for producing same, resin composition thereof, and cured product 日铁化学材料株式会社 2021-04-23 CN disclosed
US-20200377662-A1 EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2020-12-03 US disclosed
CN-111741994-A Epoxy group-containing polyorganosiloxane, curable resin composition containing epoxy group-containing polyorganosiloxane, and cured product thereof 三菱化学株式会社 2020-10-02 CN disclosed
EP-3632951-A1 EPOXY RESIN, EPOXY RESIN-CONTAINING COMPOSITION AND CURED PRODUCT OF SAME Mitsubishi Chemical Corporation (JP) 2020-04-08 EP disclosed
US-20200087442-A1 EPOXY RESIN, EPOXY RESIN-CONTAINING COMPOSITION AND CURED PRODUCT THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2020-03-19 US disclosed
CN-110662782-A Epoxy resin, composition containing epoxy resin, and cured product thereof 三菱化学株式会社 2020-01-07 CN disclosed
CN-102212168-B Photo-curable resin composition, prism sheet, backlight unit and liquid crystal display device TONGWOO FINE CHEMICALS CO., LTD. (KR) 2014-10-22 CN disclosed
CN-102212168-A Photo-curable resin composition, prism sheet, backlight unit and liquid crystal display device DONGWOO FINE CHEM CO LTD 2011-10-12 CN disclosed
CN-100341852-C Sulfur-bearing unsaturated carboxylic ester compound and use thereof MITSUI CHEMICAL IND CO LTD (JP) 2007-10-10 CN disclosed
CN-1283614-A Sulfur-bearing unsaturated carboxylic ester compound and use thereof MITSUI CHEMICAL IND CO LTD (JP) 2001-02-14 CN disclosed
US-5374668-A High refractive index and surface accuracy MITSUI TOATSU CHEMICALS, INC. (JP) 1994-12-20 US disclosed