Questiomycin B

Questiomycin B

SCHEMBL28007145

C(OCC1CO1)C1CO1.Nc1ccccc1O

nearest known ligand 0.52

Full drug profile on Sugi Atlas →

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.52
ALOX15 P16050 1/20 0.52
TDP1 Q9NUW8 1/20 0.44
ALDH1A1 P00352 3/20 0.41
GLA P06280 1/20 0.41
SMN1; SMN2 Q16637 2/20 0.40
TP53 P04637 1/20 0.40
CYP3A4 P08684 1/20 0.40
HIF1A Q16665 1/20 0.40
MGLL Q99685 3/20 0.37
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36
MAPK1 P28482 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Catechol SCHEMBL679936 0.87 TDP1 (0.52) TSHRALOX15TDP1ALDH1A1GLA
SCHEMBL28288272 0.83 TSHR (0.38) TSHRALOX15TDP1ALDH1A1GLA
SCHEMBL394006 0.82 TDP1 (0.47) TSHRTDP1ALDH1A1GLASMN1; SMN2
Questiomycin B SCHEMBL3614014 0.82 ALOX15 (0.56) TSHRALOX15TDP1ALDH1A1GLA
Questiomycin B SCHEMBL27592293 0.82 ALOX15 (0.56) TSHRALOX15TDP1ALDH1A1GLA
SCHEMBL9419945 0.81 TDP1 (0.43) TSHRTDP1ALDH1A1GLASMN1; SMN2
Orthocresol SCHEMBL1287877 0.81 ALDH1A1 (0.54) TSHRTDP1ALDH1A1GLASMN1; SMN2
SCHEMBL2301121 0.79 HSPA5 (0.55) TSHRTDP1ALDH1A1GLASMN1; SMN2
SCHEMBL6894129 0.79 ALDH1A1 (0.49) TSHRTDP1ALDH1A1GLASMN1; SMN2
2-Chlorophenol SCHEMBL8863363 0.79 ALDH1A1 (0.52) TSHRTDP1ALDH1A1GLASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113999637-B Single-component low-temperature epoxy adhesive and preparation method thereof 韦尔通科技股份有限公司 2023-08-04 CN disclosed
CN-113999637-A Single-component low-temperature epoxy adhesive and preparation method thereof 韦尔通(厦门)科技股份有限公司 2022-02-01 CN disclosed
CN-104411768-A Ultrafine poly(phenylene ether) particles and compositions derived therefrom SABIC INNOVATIVE PLASTICS IP 2015-03-11 CN disclosed