Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | F2 | P00734 | 1/20 | 0.57 |
| ▸ | LMNA | P02545 | 1/20 | 0.57 |
| ▸ | CES2 | O00748 | 1/20 | 0.52 |
| ▸ | CES1 | P23141 | 1/20 | 0.52 |
| ▸ | NPC1 | O15118 | 3/20 | 0.51 |
| ▸ | RAB9A | P51151 | 3/20 | 0.51 |
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.50 |
| ▸ | TSHR | P16473 | 2/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.50 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.49 |
| ▸ | KMT2A | Q03164 | 5/20 | 0.49 |
| ▸ | MAPT | P10636 | 3/20 | 0.49 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.49 |
| ▸ | PKM | P14618 | 1/20 | 0.49 |
| ▸ | MEN1 | O00255 | 2/20 | 0.47 |
| ▸ | PARP10 | Q53GL7 | 1/20 | 0.47 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.44 |
| ▸ | PTK2B | Q14289 | 1/20 | 0.44 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10560176 | 0.90 | F2 (0.70) | F2LMNACES2CES1RAB9A | |
| SCHEMBL28209322 | 0.87 | ALDH1A1 (0.50) | F2LMNACES2CES1NPC1 | |
| SCHEMBL5244678 | 0.86 | F2 (0.70) | F2LMNACES2CES1RAB9A | |
| Benzoic Acid 4-Methylphenyl Ester SCHEMBL1546372 | 0.85 | KMT2A (0.66) | LMNACES2CES1NPC1RAB9A | |
| SCHEMBL6554993 | 0.84 | LMNA (0.74) | F2LMNACES2CES1NPC1 | |
| SCHEMBL10560170 | 0.83 | LMNA (0.59) | F2LMNACES2RAB9ATDP1 | |
| SCHEMBL15382236 | 0.83 | PARP10 (0.68) | LMNACES2CES1NPC1RAB9A | |
| SCHEMBL26038899 | 0.83 | PARP10 (0.68) | LMNACES2CES1NPC1RAB9A | |
| SCHEMBL28051725 | 0.83 | F2 (0.59) | F2LMNACES2CES1TDP1 | |
| Benzoyl Peroxide SCHEMBL11146753 | 0.82 | LMNA (0.77) | F2LMNACES2CES1NPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 178 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8173048-B2 | Composition for circuit connection film and circuit connection film using the same | CHEIL INDUSTRIES, INC. (KR) | 2012-05-08 | — | — | US | claimed |
| US-20100148130-A1 | Composition for circuit connection film and circuit connection film using the same | KUKDO ADVANCED MATERIALS CO., LTD. (KR) | 2010-06-17 | — | — | US | claimed |
| CN-1328254-C | Metal bis (trifluoromethanesulfonyl) imide compounds and methods of synthesizing metal bis (trifluoromethanesulfonyl) imide compounds | UNIV BELFAST (GB) | 2007-07-25 | — | — | CN | claimed |
| EP-4679493-A1 | METHOD FOR PRODUCING THIN WAFER, WAFER LAMINATE AND TEMPORARY ADHESIVE FOR WAFER PROCESSING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-14 | — | — | EP | disclosed |
| US-20250346702-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER | RESONAC CORP (JP) | 2025-11-13 | — | — | US | disclosed |
| US-20250297092-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ESTER-BASED THIXOTROPY-IMPARTING AGENT | RESONAC CORPORATION (JP) | 2025-09-25 | — | — | US | disclosed |
| WO-2025109868-A1 | THERMOSETTING SILICONE COMPOSITION, DIE BONDING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE | 信越化学工業株式会社 | 2025-05-30 | — | — | WO | disclosed |
| EP-4512837-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER | Resonac Corporation (JP) | 2025-02-26 | — | — | EP | disclosed |
| WO-2025018368-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE | 株式会社レゾナック | 2025-01-23 | — | — | WO | disclosed |
| WO-2025013758-A1 | ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT FILM FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING SAME | 株式会社レゾナック | 2025-01-16 | — | — | WO | disclosed |
| US-20250022829-A1 | UNDERFILL MATERIAL | AJINOMOTO CO., INC. (JP) | 2025-01-16 | — | — | US | disclosed |
| EP-1057843-B1 | Aqueous emulsion, process for producing the same and aqueous paint and aqueous printing ink comprising the same | NIPPON POLYURETHANE KOGYO KK (JP) | 2004-09-15 | — | — | EP | disclosed |
| CN-1507371-A | Metal bis (trifluoromethanesulfonyl) imide compounds and methods of synthesizing metal bis (trifluoromethanesulfonyl) imide compounds | ʺ��ѧ | 2004-06-23 | — | — | CN | disclosed |
| US-20030178138-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-25 | — | — | US | disclosed |
| US-20030141014-A1 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2003-07-31 | — | — | US | disclosed |
| US-6306947-B1 | Printing ink and paint composed of an aqueous emulsion of self-emulsifiable urethane copolymer | NIPPON POLYURETHANE INDUSTRY CO., LTD. (JP) | 2001-10-23 | — | — | US | disclosed |
| EP-1057843-A1 | Aqueous emulsion, process for producing the same and aqueous paint and aqueous printing ink comprising the same | NIPPON POLYURETHANE INDUSTRY CO. LTD. (JP) | 2000-12-06 | — | — | EP | disclosed |
| US-4684670-A | CROSSLINKING BY HYDROSILATION, PERBENZOATE OR POLYAROMATIC KETONE INITIATORS | GENERAL ELECTRIC COMPANY (US) | 1987-08-04 | — | — | US | disclosed |
| US-4608312-A | MERCAPTOALKOXYALKYL POLYSILOXANES AND VINYL POLYSILOXANES | GENERAL ELECTRIC COMPANY (US) | 1986-08-26 | — | — | US | disclosed |
| US-4558147-A | ODORLESS MERCAPTOALKOXYALKYL-FUNCTIONAL POLYSILOXANES AND VINYL-FUNCTIONAL PHOTOREACTIVE TERPOLYMERS | GENERAL ELECTRIC COMPANY (US) | 1985-12-10 | — | — | US | disclosed |