⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11157039 | 0.75 | — | — | |
| SCHEMBL28032452 | 0.74 | — | — | |
| SCHEMBL27553143 | 0.72 | — | — | |
| SCHEMBL5153426 | 0.72 | — | — | |
| SCHEMBL1775067 | 0.72 | — | — | |
| SCHEMBL29262189 | 0.72 | — | — | |
| SCHEMBL6341539 | 0.72 | — | — | |
| SCHEMBL28675570 | 0.72 | — | — | |
| SCHEMBL5280106 | 0.72 | — | — | |
| Iodide SCHEMBL29198705 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114805805-B | Polyimide with high adhesive strength and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2023-12-19 | — | — | CN | claimed |
| CN-105254884-B | Polyimide Precursor and Polyimide | 宇部兴产株式会社 | 2018-05-29 | — | — | CN | disclosed |
| CN-105254883-B | Polyimide Precursor and Polyimide | 宇部兴产株式会社 | 2018-02-02 | — | — | CN | disclosed |
| CN-105254884-A | POLYIMIDE PRECURSOR AND POLYIMIDE | UBE INDUSTRIES | 2016-01-20 | — | — | CN | disclosed |
| CN-105254885-A | POLYIMIDE PRECURSOR AND POLYIMIDE | UBE INDUSTRIES | 2016-01-20 | — | — | CN | disclosed |
| CN-105254883-A | POLYIMIDE PRECURSOR AND POLYIMIDE | UBE INDUSTRIES | 2016-01-20 | — | — | CN | disclosed |
| CN-103534294-B | Polyimide precursor and polyimide | UBE INDUSTRIES, LTD. (JP) | 2015-09-30 | — | — | CN | disclosed |
| CN-103534294-A | Polyimide precursor and polyimide | UBE INDUSTRIES | 2014-01-22 | — | — | CN | disclosed |
| US-5300619-A | Dimensinal stability: high density packaging of electronics | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1994-04-05 | — | — | US | disclosed |