Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES1 | P23141 | 2/20 | 0.50 |
| ▸ | SRC | P12931 | 1/20 | 0.46 |
| ▸ | HPGD | P15428 | 1/20 | 0.41 |
| ▸ | HTT | P42858 | 1/20 | 0.40 |
| ▸ | TSHR | P16473 | 2/20 | 0.40 |
| ▸ | CHRM3 | P20309 | 2/20 | 0.40 |
| ▸ | POLB | P06746 | 3/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | CA2 | P00918 | 1/20 | 0.39 |
| ▸ | KCNN4 | O15554 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 3/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.38 |
| ▸ | AKT1 | P31749 | 1/20 | 0.37 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12003255 | 0.85 | CES1 (0.46) | CES1SRCHPGDTSHRTDP1 | |
| SCHEMBL2819529 | 0.83 | CES1 (0.45) | CES1SRCTSHRTDP1LMNA | |
| SCHEMBL3266492 | 0.83 | CES1 (0.65) | CES1SRCHPGDHTTTSHR | |
| SCHEMBL251616 | 0.82 | CES1 (0.50) | CES1SRCPOLBKCNN4LMNA | |
| SCHEMBL10609830 | 0.81 | TSHR (0.44) | CES1TSHRLMNAALDH1A1 | |
| SCHEMBL1470605 | 0.81 | TSHR (0.44) | CES1TSHRLMNAALDH1A1 | |
| SCHEMBL277653 | 0.80 | CES1 (0.65) | CES1SRCTSHRTDP1KCNN4 | |
| SCHEMBL9192066 | 0.79 | CES1 (0.47) | CES1SRCTSHRPOLBTDP1 | |
| SCHEMBL9785859 | 0.79 | CES1 (0.59) | CES1SRCHPGDHTTTSHR | |
| SCHEMBL10384203 | 0.79 | CES1 (0.46) | CES1SRCHPGDHTTTSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240010829-A1 | POLYMERIZABLE COMPOSITION AND MANUFACTURING METHOD FOR ELEMENT-MOUNTED SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-01-11 | — | — | US | disclosed |
| EP-3284771-B1 | HEAT-RESISTANT RESIN COMPOSITION, METHOD FOR MANUFACTURING HEAT-RESISTANT RESIN FILM, METHOD FOR MANUFACTURING INTERLAYER INSULATION FILM OR SURFACE PROTECTIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR COMPONENT | TORAY INDUSTRIES (JP) | 2023-08-30 | — | — | EP | disclosed |
| EP-3800218-A1 | TRANSPARENT RESIN COMPOSITION FOR MOLDING AND 3D MOLDED ARTICLE | Nabtesco Corporation (JP) | 2021-04-07 | — | — | EP | disclosed |
| EP-3284771-A1 | HEAT-RESISTANT RESIN COMPOSITION, METHOD FOR MANUFACTURING HEAT-RESISTANT RESIN FILM, METHOD FOR MANUFACTURING INTERLAYER INSULATION FILM OR SURFACE PROTECTIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR COMPONENT | Toray Industries, Inc. (JP) | 2018-02-21 | — | — | EP | disclosed |
| EP-2270110-B1 | PIGMENT-DISPERSED COMPOSITION, COLORED PHOTOSENSITIVE COMPOSITION, PHOTOCURABLE COMPOSITION, COLOR FILTER, LIQUID CRYSTAL DISPLAY ELEMENT, AND SOLID IMAGE PICKUP ELEMENT | FUJIFILM CORP (JP) | 2015-02-25 | — | — | EP | disclosed |
| US-8895676-B2 | Resin composition and display device using the same | TORAY INDUSTRIES, INC. (JP) | 2014-11-25 | — | — | US | disclosed |
| US-20140191222-A1 | RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME | TORAY INDUSTRIES, INC. (JP) | 2014-07-10 | — | — | US | disclosed |
| US-8709552-B2 | Resin composition and display device using the same | TORAY INDUSTRIES, INC. (JP) | 2014-04-29 | — | — | US | disclosed |
| US-8514353-B2 | Color filter and electronic display device | FUJIFILM CORPORATION (JP) | 2013-08-20 | — | — | US | disclosed |
| EP-2218756-B1 | PIGMENT DISPERSION COMPOSITION, CURABLE COLOR COMPOSITION, COLOR FILTER AND METHOD FOR PRODUCING THE SAME | FUJIFILM CORP (JP) | 2013-07-31 | — | — | EP | disclosed |
| EP-0580108-B1 | A photosensitive polyimide composition | ASAHI CHEMICAL IND (JP) | 1997-03-12 | — | — | EP | disclosed |
| US-5525645-A | Resin composition for optical molding | ASAHI DENKA KOGYO K.K. (JP) | 1996-06-11 | — | — | US | disclosed |
| US-5434196-A | Resin composition for optical molding | ASAHI DENKA KOGYO K.K. (JP) | 1995-07-18 | — | — | US | disclosed |
| EP-0439258-B1 | Actinic radiation-reactive pressure-sensitive adhesive composition | ASAHI DENKA KOGYO KK (JP) | 1995-05-03 | — | — | EP | disclosed |
| EP-0355927-B1 | A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor | ASAHI CHEMICAL IND (JP) | 1994-11-23 | — | — | EP | disclosed |
| US-5360873-A | Acrylate copolymer, polythiol compound and polyene compound, mounting semiconductor wafers | ASAHI DENKA KOGYO K.K. (JP) | 1994-11-01 | — | — | US | disclosed |
| US-5278199-A | Comprising polythiol compounds and polyene compounds | ASAHI DENKA KOGYO K.K. (JP) | 1994-01-11 | — | — | US | disclosed |
| EP-0439258-A2 | Actinic radiation-reactive pressure-sensitive adhesive composition | ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) | 1991-07-31 | — | — | EP | disclosed |
| EP-0355927-A2 | A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1990-02-28 | — | — | EP | disclosed |
| US-4812489-A | URETHANE ACRYLATE OLIGOMER, TRIS(2-HYDROXYETHYL)ISOCYANURATE TRIACRYLATE, REACTIVE DILUENT, AND A PHOTOPOLYMERIZATION INIATOR; CLADDING, BUFFER MATERIALS FOR OPTICAL FIBER UNITS | THE YOKOHAMA RUBBER CO., LTD. (JP) | 1989-03-14 | — | — | US | disclosed |