SCHEMBL9491503

SCHEMBL9491503

CCCCCCCCCCCCCCCCCC(=O)NN.O=C(O)c1cccc2[nH]nnc12

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTPN2 P17706 1/20 0.41
PTPN1 P18031 1/20 0.41
PTPN6 P29350 1/20 0.41
CDC25B P30305 1/20 0.41
PTPN11 Q06124 1/20 0.41
SPHK2 Q9NRA0 1/20 0.41
SPHK1 Q9NYA1 1/20 0.41
ALDH1A1 P00352 2/20 0.39
NPC1 O15118 1/20 0.39
RAB9A P51151 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
EPHX2 P34913 1/20 0.39
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
MTNR1A P48039 1/20 0.36
KDM4E B2RXH2 1/20 0.36
HPGD P15428 1/20 0.36
HSD17B10 Q99714 1/20 0.36
SOAT1 P35610 3/20 0.36
CA12 O43570 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28472895 0.81 HTT (0.46) PTPN2PTPN1PTPN6CDC25BPTPN11
SCHEMBL28136960 0.80 KDM4E (0.37) PTPN2PTPN1PTPN6CDC25BPTPN11
SCHEMBL26963405 0.80 TSHR (0.37) PTPN2PTPN1PTPN6CDC25BPTPN11
SCHEMBL29906283 0.79 KDM4E (0.36) PTPN2PTPN1PTPN6CDC25BPTPN11
SCHEMBL170674 0.78 KDM4E (0.47) ALDH1A1KDM4EHPGD
SCHEMBL29453826 0.78 KDM4E (0.47) ALDH1A1KDM4EHPGD
SCHEMBL9491496 0.76 SPHK2 (0.34) PTPN2PTPN1PTPN6CDC25BPTPN11
SCHEMBL11669218 0.76 CETP (0.50) SPHK2SPHK1ALDH1A1NPC1RAB9A
SCHEMBL9172345 0.76 KDM4E (0.46) ALDH1A1KDM4EHPGD
SCHEMBL3840407 0.76 KDM4E (0.46) ALDH1A1KDM4EHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0300453-B1 COPPER-TYPE CONDUCTIVE COATING COMPOSITION MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1993-03-03 EP claimed
EP-0300453-B1 COPPER-TYPE CONDUCTIVE COATING COMPOSITION MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1993-03-03 EP disclosed
US-4921623-A COPPER POWDER, SALICYCLIC ACID DERIVATIVE, STABILITY MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1990-05-01 US disclosed
EP-0300453-A2 Copper-type conductive coating composition MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1989-01-25 EP disclosed