Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 6/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.37 |
| ▸ | MEN1 | O00255 | 3/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.35 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.31 |
| ▸ | HPGD | P15428 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL949187 | 0.98 | ALDH1A1 (0.36) | KDM4EALDH1A1MEN1KMT2APOLB | |
| SCHEMBL1477235 | 0.95 | KDM4E (0.38) | KDM4EALDH1A1MEN1KMT2APOLB | |
| SCHEMBL16335885 | 0.88 | KDM4E (0.40) | KDM4EALDH1A1MEN1KMT2APOLB | |
| SCHEMBL115037 | 0.88 | KDM4E (0.40) | KDM4EALDH1A1MEN1KMT2APOLB | |
| SCHEMBL6063317 | 0.86 | KDM4E (0.36) | KDM4EALDH1A1MEN1KMT2APOLB | |
| SCHEMBL6063818 | 0.86 | KDM4E (0.36) | KDM4EALDH1A1MEN1KMT2APOLB | |
| SCHEMBL29859662 | 0.84 | ALDH1A1 (0.39) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL6063400 | 0.84 | ALDH1A1 (0.36) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL6064093 | 0.84 | ALDH1A1 (0.36) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL6063639 | 0.84 | ALDH1A1 (0.36) | KDM4EALDH1A1MEN1KMT2AHTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2477215-A2 | Resin composition, embedding material, insulating layer and semiconductor device | Sumitomo Bakelite Company Limited (JP) | 2012-07-18 | — | — | EP | disclosed |
| US-7999354-B2 | Resin composition, filling material, insulating layer and semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-08-16 | — | — | US | disclosed |
| US-7875686-B2 | comprising 10 to 99 wt. % of norbornene-type cycloolefin monomers; for microelectronic, optoelectronic and micro-optoelectronic applications such as die attach adhesives, underfill materials, prepreg binders, encapsulants | PROMERUS LLC (US) | 2011-01-25 | — | — | US | disclosed |
| US-20100181684-A1 | RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2010-07-22 | — | — | US | disclosed |
| EP-2166036-A1 | RESIN COMPOSITION, EMBEDDING MATERIAL, INSULATING LAYER, AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company Limited (JP) | 2010-03-24 | — | — | EP | disclosed |
| EP-1791888-B1 | POLYCYCLOOLEFIN POLYMERIC COMPOSITIONS FOR SEMICONDUCTOR APPLICATIONS | PROMERUS LLC (US) | 2009-03-25 | — | — | EP | disclosed |
| EP-1791888-A1 | POLYCYCLOOLEFIN POLYMERIC COMPOSITIONS FOR SEMICONDUCTOR APPLICATIONS | Promerus, LLC (US) | 2007-06-06 | — | — | EP | disclosed |
| WO-2006023511-A1 | POLYCYCLOOLEFIN POLYMERIC COMPOSITIONS FOR SEMICONDUCTOR APPLICATIONS | PROMERUS LLC (US) | 2006-03-02 | — | — | WO | disclosed |
| US-20060041093-A1 | Polycycloolefin polymeric compositions for semiconductor applications | SUMITOMO BAKELITE CO., LTD. (JP) | 2006-02-23 | — | — | US | disclosed |