SCHEMBL9547567

SCHEMBL9547567

O=C(O)c1ccc(C(=O)O)c(C(=O)O)c1CCCCCCc1c(C(=O)O)ccc(C(=O)O)c1C(=O)O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PPARA Q07869 4/20 0.41
CYP1A2 P05177 1/20 0.41
RARB P10826 3/20 0.41
PPARG P37231 2/20 0.38
BID P55957 4/20 0.38
MCL1 Q07820 4/20 0.38
KAT8 Q9H7Z6 4/20 0.38
BCL2L1 Q07817 3/20 0.38
BAK1 Q16611 3/20 0.38
EP300 Q09472 1/20 0.38
KAT2A Q92830 1/20 0.38
KAT2B Q92831 1/20 0.38
KAT5 Q92993 1/20 0.38
SAE1 Q9UBE0 1/20 0.38
RARA P10276 1/20 0.37
RARG P13631 1/20 0.37
PLK1 P53350 1/20 0.36
ALDH1A1 P00352 1/20 0.36
ALOX15 P16050 1/20 0.36
SLC16A3 O15427 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9547631 1.00 PPARA (0.41) PPARACYP1A2RARBPPARGBID
SCHEMBL9547569 0.98 CYP1A2 (0.42) PPARACYP1A2RARBPPARGBID
SCHEMBL9547628 0.94 CYP1A2 (0.42) PPARACYP1A2RARBALDH1A1ALOX15
SCHEMBL1264820 0.91 PPARA (0.54) PPARARARBPPARGBIDMCL1
SCHEMBL5072778 0.91 PPARA (0.54) PPARARARBPPARGBIDMCL1
SCHEMBL11146346 0.91 PPARA (0.54) PPARARARBPPARGBIDMCL1
SCHEMBL19953532 0.91 PPARA (0.54) PPARARARBPPARGBIDMCL1
SCHEMBL106659 0.89 CYP1A2 (0.46) CYP1A2ALDH1A1ALOX15
SCHEMBL31153153 0.89 PPARA (0.37) PPARACYP1A2RARBPPARGBID
SCHEMBL31153155 0.89 PPARA (0.37) PPARACYP1A2RARBPPARGBID

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5115089-A Heat resistant polymers for electrical insulation, protective coatings for electronics formed by reaction of tetracarboxylic dianhydrides and diaminoamides and diamines HITACHI CHEMICAL CO., LTD. (JP) 1992-05-19 US claimed
US-20120202015-A1 METHOD FOR MANUFACTURING ADHESION BODY, METHOD FOR MANUFACTURING SUBSTRATE WITH ADHESIVE PATTERN, AND SUBSTRATE WITH ADHESIVE PATTERN HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-08-09 US disclosed
EP-0308270-B1 Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof HITACHI CHEMICAL CO LTD (JP) 1993-12-08 EP disclosed
US-5115089-A Heat resistant polymers for electrical insulation, protective coatings for electronics formed by reaction of tetracarboxylic dianhydrides and diaminoamides and diamines HITACHI CHEMICAL CO., LTD. (JP) 1992-05-19 US disclosed
EP-0308270-A2 Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof Hitachi Chemical Co., Ltd. (JP) 1989-03-22 EP disclosed