SCHEMBL106659

SCHEMBL106659

O=C(O)c1ccc(C(=O)O)c(C(=O)O)c1CCc1c(C(=O)O)ccc(C(=O)O)c1C(=O)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.46
ALDH1A1 P00352 5/20 0.40
ALOX15 P16050 1/20 0.40
SELL P14151 1/20 0.38
SELP P16109 1/20 0.38
KLKB1 P03952 1/20 0.38
CTSB P07858 1/20 0.38
MMP9 P14780 1/20 0.38
DNMT1 P26358 1/20 0.38
DNMT3B Q9UBC3 1/20 0.38
DNMT3L Q9UJW3 1/20 0.38
DNMT3A Q9Y6K1 1/20 0.38
FOLH1 Q04609 2/20 0.37
CA12 O43570 3/20 0.37
CA1 P00915 3/20 0.37
CA2 P00918 3/20 0.37
CA7 P43166 3/20 0.37
CA9 Q16790 3/20 0.37
CA14 Q9ULX7 3/20 0.37
TSHR P16473 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9547628 0.91 CYP1A2 (0.42) CYP1A2ALDH1A1ALOX15SELLSELP
SCHEMBL9547569 0.91 CYP1A2 (0.42) CYP1A2ALDH1A1ALOX15SELLSELP
SCHEMBL9547567 0.89 PPARA (0.41) CYP1A2ALDH1A1ALOX15
SCHEMBL9547631 0.89 PPARA (0.41) CYP1A2ALDH1A1ALOX15
SCHEMBL6054195 0.88 CYP1A2 (0.37) CYP1A2ALDH1A1ALOX15SELLSELP
SCHEMBL31153152 0.87 CYP1A2 (0.39) CYP1A2ALDH1A1ALOX15SELLSELP
SCHEMBL8577014 0.86 CYP1A2 (0.46) CYP1A2ALDH1A1ALOX15SELLSELP
SCHEMBL5072798 0.84 GABRP (0.49) CYP1A2ALDH1A1ALOX15TSHRHSD17B10
SCHEMBL5134495 0.82 GABRP (0.43) CYP1A2ALDH1A1ALOX15SELLSELP
SCHEMBL11146346 0.81 PPARA (0.54) ALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5115089-A Heat resistant polymers for electrical insulation, protective coatings for electronics formed by reaction of tetracarboxylic dianhydrides and diaminoamides and diamines HITACHI CHEMICAL CO., LTD. (JP) 1992-05-19 US claimed
US-4064289-A Method of making a semiconductor device HITACHI, LTD. (JA) 1977-12-20 US claimed
JP-1163214-A None JP disclosed
CN-119724695-A Insulated wire, method of manufacturing the same, coil, and electronic apparatus 奇美实业股份有限公司 2025-03-28 CN disclosed
CN-119708768-A Polymer film and method for producing same 奇美实业股份有限公司 2025-03-28 CN disclosed
CN-118475649-A Fluororesin composition, fluororesin film, laminate film, and metal laminate sheet 株式会社有泽制作所 2024-08-09 CN disclosed
US-8779085-B2 Modified polyimide and method for producing modified polyimide PI R&D CO., LTD. (JP) 2014-07-15 US disclosed
CN-103380491-A Manufacturing method for adhered material, manufacturing method for substrate having adhesive pattern, and substrate having adhesive pattern HITACHI CHEMICAL CO LTD 2013-10-30 CN disclosed
US-20120202015-A1 METHOD FOR MANUFACTURING ADHESION BODY, METHOD FOR MANUFACTURING SUBSTRATE WITH ADHESIVE PATTERN, AND SUBSTRATE WITH ADHESIVE PATTERN HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-08-09 US disclosed
US-20120097439-A1 MODIFIED POLYIMIDE AND METHOD FOR PRODUCING MODIFIED POLYIMIDE PI R&D CO., LTD. (JP) 2012-04-26 US disclosed
EP-2431400-A2 MODIFIED POLYIMIDE AND METHOD FOR PRODUCING MODIFIED POLYIMIDE PI R & D Co. Ltd (JP) 2012-03-21 EP disclosed
US-5527621-A TREATING WITH SOLUTION OF BASIC COMPOUND, THEN WITH SOLUTION OF SILANE COUPLING AGENT, HEAT TREATING, APPLYING POLYIMIDE ADHESIVE HITACHI CHEMICAL CO., LTD. (JP) 1996-06-18 US disclosed
US-5510425-A AROMATIC POLYIMIDE-EPOXY COPOLYMER MODIFIED BY BISMALEIMIDE COMPOUND; FLEXIBILITY, PEELING STRENGTH; COLDSETTING RESINS, ADHESIVES HITACHI CHEMICAL COMPANY, LTD. (JP) 1996-04-23 US disclosed
US-5508357-A SOLUBILITY IN SOLVENT, LOW MELTING POINT HITACHI CHEMICAL COMPANY, LTD. (JP) 1996-04-16 US disclosed
EP-0308270-B1 Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof HITACHI CHEMICAL CO LTD (JP) 1993-12-08 EP disclosed
EP-0553612-A2 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO., LTD. (JP) 1993-08-04 EP disclosed
US-5115089-A Heat resistant polymers for electrical insulation, protective coatings for electronics formed by reaction of tetracarboxylic dianhydrides and diaminoamides and diamines HITACHI CHEMICAL CO., LTD. (JP) 1992-05-19 US disclosed
JP-H01163214-A PRODUCTION OF POLYIMIDOISOINDOLOQUINAZOLINEDIXONE AND PRECURSOR THEREOF HITACHI CHEM CO LTD 1989-06-27 JP disclosed
EP-0308270-A2 Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof Hitachi Chemical Co., Ltd. (JP) 1989-03-22 EP disclosed
US-4064289-A Method of making a semiconductor device HITACHI, LTD. (JA) 1977-12-20 US disclosed