SCHEMBL9547571

SCHEMBL9547571

O=C(O)c1cc(CCCCc2cc(C(=O)O)cc(C(=O)O)c2C(=O)O)c(C(=O)O)c(C(=O)O)c1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.38
F13A1 P00488 3/20 0.36
PTPN1 P18031 1/20 0.36
PTPN11 Q06124 1/20 0.36
BID P55957 4/20 0.36
MCL1 Q07820 4/20 0.36
BCL2L1 Q07817 3/20 0.36
BAK1 Q16611 3/20 0.36
KAT8 Q9H7Z6 2/20 0.36
PPARG P37231 1/20 0.36
PPARA Q07869 1/20 0.36
EP300 Q09472 1/20 0.36
KAT2A Q92830 1/20 0.36
KAT2B Q92831 1/20 0.36
KAT5 Q92993 1/20 0.36
SAE1 Q9UBE0 1/20 0.36
CA12 O43570 1/20 0.35
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
CA7 P43166 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1665683 0.98 F13A1 (0.39) ALDH1A1F13A1PTPN1PTPN11BID
SCHEMBL9547634 0.98 F13A1 (0.39) ALDH1A1F13A1PTPN1PTPN11BID
SCHEMBL11899227 0.98 F13A1 (0.39) ALDH1A1F13A1PTPN1PTPN11BID
SCHEMBL9547651 0.98 F13A1 (0.39) ALDH1A1F13A1PTPN1PTPN11BID
SCHEMBL11899221 0.98 F13A1 (0.39) ALDH1A1F13A1PTPN1PTPN11BID
SCHEMBL9547648 0.98 F13A1 (0.39) ALDH1A1F13A1PTPN1PTPN11BID
SCHEMBL9547568 0.98 F13A1 (0.39) ALDH1A1F13A1PTPN1PTPN11BID
SCHEMBL11899588 0.98 F13A1 (0.39) ALDH1A1F13A1PTPN1PTPN11BID
SCHEMBL9547579 0.98 F13A1 (0.39) ALDH1A1F13A1PTPN1PTPN11BID
SCHEMBL9547629 0.96 ALDH1A1 (0.38) ALDH1A1PTPN1PTPN11BIDMCL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5115089-A Heat resistant polymers for electrical insulation, protective coatings for electronics formed by reaction of tetracarboxylic dianhydrides and diaminoamides and diamines HITACHI CHEMICAL CO., LTD. (JP) 1992-05-19 US claimed
US-20120202015-A1 METHOD FOR MANUFACTURING ADHESION BODY, METHOD FOR MANUFACTURING SUBSTRATE WITH ADHESIVE PATTERN, AND SUBSTRATE WITH ADHESIVE PATTERN HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-08-09 US disclosed
EP-0308270-B1 Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof HITACHI CHEMICAL CO LTD (JP) 1993-12-08 EP disclosed
US-5115089-A Heat resistant polymers for electrical insulation, protective coatings for electronics formed by reaction of tetracarboxylic dianhydrides and diaminoamides and diamines HITACHI CHEMICAL CO., LTD. (JP) 1992-05-19 US disclosed
EP-0308270-A2 Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof Hitachi Chemical Co., Ltd. (JP) 1989-03-22 EP disclosed