SCHEMBL9547579

SCHEMBL9547579

O=C(O)c1cc(CCCCCCCc2cc(C(=O)O)cc(C(=O)O)c2C(=O)O)c(C(=O)O)c(C(=O)O)c1

nearest known ligand 0.39

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
F13A1 P00488 3/20 0.39
BID P55957 4/20 0.38
MCL1 Q07820 4/20 0.38
KAT8 Q9H7Z6 4/20 0.38
BCL2L1 Q07817 3/20 0.38
BAK1 Q16611 3/20 0.38
PPARA Q07869 3/20 0.38
PPARG P37231 1/20 0.38
EP300 Q09472 1/20 0.38
KAT2A Q92830 1/20 0.38
KAT2B Q92831 1/20 0.38
KAT5 Q92993 1/20 0.38
SAE1 Q9UBE0 1/20 0.38
ALDH1A1 P00352 1/20 0.37
SLC16A3 O15427 1/20 0.35
PTPN1 P18031 1/20 0.35
PTPN11 Q06124 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1665683 1.00 F13A1 (0.39) F13A1BIDMCL1KAT8BCL2L1
SCHEMBL9547568 1.00 F13A1 (0.39) F13A1BIDMCL1KAT8BCL2L1
SCHEMBL11899221 1.00 F13A1 (0.39) F13A1BIDMCL1KAT8BCL2L1
SCHEMBL9547651 1.00 F13A1 (0.39) F13A1BIDMCL1KAT8BCL2L1
SCHEMBL11899227 1.00 F13A1 (0.39) F13A1BIDMCL1KAT8BCL2L1
SCHEMBL9547648 1.00 F13A1 (0.39) F13A1BIDMCL1KAT8BCL2L1
SCHEMBL9547634 1.00 F13A1 (0.39) F13A1BIDMCL1KAT8BCL2L1
SCHEMBL11899588 1.00 F13A1 (0.39) F13A1BIDMCL1KAT8BCL2L1
SCHEMBL9547571 0.98 ALDH1A1 (0.38) F13A1BIDMCL1KAT8BCL2L1
SCHEMBL9547629 0.94 ALDH1A1 (0.38) BIDMCL1BCL2L1BAK1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5115089-A Heat resistant polymers for electrical insulation, protective coatings for electronics formed by reaction of tetracarboxylic dianhydrides and diaminoamides and diamines HITACHI CHEMICAL CO., LTD. (JP) 1992-05-19 US claimed
JP-2168618-A None JP disclosed
US-20120202015-A1 METHOD FOR MANUFACTURING ADHESION BODY, METHOD FOR MANUFACTURING SUBSTRATE WITH ADHESIVE PATTERN, AND SUBSTRATE WITH ADHESIVE PATTERN HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-08-09 US disclosed
EP-0308270-B1 Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof HITACHI CHEMICAL CO LTD (JP) 1993-12-08 EP disclosed
US-5115089-A Heat resistant polymers for electrical insulation, protective coatings for electronics formed by reaction of tetracarboxylic dianhydrides and diaminoamides and diamines HITACHI CHEMICAL CO., LTD. (JP) 1992-05-19 US disclosed
JP-H02168618-A INTERLAYER INSULATING FILM AND/OR COMPOSITION FOR SURFACE PROTECTING FILM OF SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE HITACHI CHEM CO LTD 1990-06-28 JP disclosed
EP-0308270-A2 Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof Hitachi Chemical Co., Ltd. (JP) 1989-03-22 EP disclosed