SCHEMBL95496

SCHEMBL95496

CCCC(C)(C)OOOC(=O)CCCCCC(C)(C)C

nearest known ligand 0.36

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.36
LMNA P02545 4/20 0.34
ALDH1A1 P00352 2/20 0.34
PAM P19021 2/20 0.33
MAPT P10636 2/20 0.33
MAPK1 P28482 1/20 0.33
TSHR P16473 1/20 0.32
NAAA Q02083 2/20 0.31
DNM1 Q05193 1/20 0.31
CES2 O00748 1/20 0.31
KDM4E B2RXH2 1/20 0.30
DUSP3 P51452 1/20 0.30
MEN1 O00255 1/20 0.30
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15758715 1.00 DGKA (0.36) DGKALMNAALDH1A1PAMMAPT
SCHEMBL29525716 0.98 ALDH1A1 (0.35) DGKALMNAALDH1A1PAMMAPT
SCHEMBL9329702 0.92 DGKA (0.42) DGKALMNAALDH1A1PAMMAPT
SCHEMBL19548683 0.90 DGKA (0.38) DGKALMNAALDH1A1PAMMAPT
SCHEMBL658315 0.89 DGKA (0.33) DGKALMNAPAMMAPTMAPK1
SCHEMBL30516705 0.89 ALDH1A1 (0.37) DGKALMNAALDH1A1PAMMAPT
SCHEMBL9842720 0.89 TSHR (0.35) DGKALMNAALDH1A1PAMMAPT
SCHEMBL7553279 0.88 CYP4F2 (0.38) DGKALMNAALDH1A1PAMMAPT
SCHEMBL29526099 0.87 DGKA (0.31) DGKA
SCHEMBL465271 0.87 DGKA (0.36) DGKALMNAALDH1A1PAMMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 314 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0989620-B1 Solid electrolyte and method for producing it DAI ICHI KOGYO SEIYAKU CO LTD (JP) 2004-01-28 EP claimed
US-6329103-B1 THERMAL CROSSLINKING WITH ORGANIC PEROXIDE INITIATOR HAVING SPECIFIC PHYSICAL PROPERTIES THAT DOES NOT CAUSE DEGRADATION OF ELECTROLYTIC SALTS AND VAPORIZATION OF SOLVENTS; ACRYLATED ALKYLENE OXIDE POLYMER DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2001-12-11 US claimed
EP-0692493-B1 Diene polymers having functional groups, their preparation and their use in silica-reinforced rubber compositions suitable for treads MICHELIN & CIE (FR) 1999-01-13 EP claimed
US-5362828-A One of which does not have benzene ring or alkoxy group; emulsion polymerization SHIN-ETSU CHEMICAL CO., LTD. (JP) 1994-11-08 US claimed
EP-3438208-B1 THERMOPLASTIC RESIN COMPOSITION, CELLULOSE-REINFORCED THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING CELLULOSE-REINFORCED THERMOPLASTIC RESIN COMPOSITION, CELLULOSE-REINFORCED RESIN MOLDED ARTICLE, AND METHOD FOR PRODUCING CELLULOSE-REINFORCED RESIN MOLDED ARTICLE FURUKAWA ELECTRIC CO LTD (JP) 2026-01-07 EP disclosed
EP-4633900-A1 SACRIFICIAL ADDITIVELY MANUFACTURED MOLD WITH CONTROLLED MOISTURE AND LIQUID ABSORPTION PROPERTIES STRATASYS, INC. (US) 2025-10-22 EP disclosed
US-20250277077-A1 RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND CURED PRODUCT OF RESIN COMPOSITION RESONAC CORPORATION (JP) 2025-09-04 US disclosed
WO-2025121227-A1 CURABLE COMPOSITION, CURED PRODUCT, ADHESIVE, AND SEALANT 四国化成工業株式会社 2025-06-12 WO disclosed
US-20250101181-A1 RESIN COMPOSITION AND PRODUCTION METHOD THEREFOR, AND CURED PRODUCT OF RESIN COMPOSITION RESONAC CORPORATION (JP) 2025-03-27 US disclosed
US-12215074-B2 Process for the production of peroxyesters NOURYON CHEMICALS INTERNATIONAL B.V. (NL) 2025-02-04 US disclosed
US-12163021-B2 Copolymer and composite resin NIPPON SHOKUBAI CO., LTD. (JP) 2024-12-10 US disclosed
WO-2024247919-A1 AZOLE COMPOUND, METHOD FOR SYNTHESIZING SAID AZOLE COMPOUND, AND USE THEREOF 四国化成工業株式会社 2024-12-05 WO disclosed
EP-0989620-A2 Solid electrolyte and method for producing it DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2000-03-29 EP disclosed
US-5449723-A Catalytic suspension polymerization of monomers, heat exchanging, fluid flow, pumping and circulation SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-09-12 US disclosed
US-5362828-A One of which does not have benzene ring or alkoxy group; emulsion polymerization SHIN-ETSU CHEMICAL CO., LTD. (JP) 1994-11-08 US disclosed
US-5286796-A Adding to polymerization mixture water insoluble partially saponified polyvinyl acetate SHIN-ETSU CHEMICAL CO., LTD. (JP) 1994-02-15 US disclosed
US-5116670-A Composed of polybasic acid and polyhydric alcohol; ester bonded to one terminal; electronics SHOWA DENKO K.K. (JP) 1992-05-26 US disclosed
US-5012010-A Polymerization initiators, curing or crosslinking agent NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1991-04-30 US disclosed
EP-0420208-A2 Allyl ester resin composition and laminated sheet using the same SHOWA DENKO KABUSHIKI KAISHA (JP) 1991-04-03 EP disclosed
EP-0408763-A1 OPTICAL DISK AND METHOD OF MANUFACTURING THE SAME SEIKO EPSON CORPORATION (JP) 1991-01-23 EP disclosed