SCHEMBL9550353

SCHEMBL9550353

O=C(O)c1ccc(-c2ccc(-c3ccc(-c4ccc(C(=O)O)c(C(=O)O)c4)cc3)cc2)cc1C(=O)O

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 2/20 0.60
KDM4E B2RXH2 1/20 0.60
GFER P55789 1/20 0.60
RXFP1 Q9HBX9 1/20 0.60
ACMSD Q8TDX5 4/20 0.59
MCL1 Q07820 4/20 0.59
HNF4A P41235 2/20 0.59
DHFR P00374 1/20 0.59
DCLRE1A Q6PJP8 1/20 0.52
DCLRE1B Q9H816 1/20 0.52
PPM1B O75688 1/20 0.52
CFD P00746 1/20 0.50
ALDH1A1 P00352 1/20 0.50
ALOX15 P16050 1/20 0.50
LCK P06239 1/20 0.50
CYP1A2 P05177 1/20 0.50
PTPN1 P18031 1/20 0.48
CDC25B P30305 2/20 0.48
HSD17B10 Q99714 2/20 0.48
CDC25A P30304 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29436303 1.00 KMT2A (0.60) KMT2AKDM4EGFERRXFP1ACMSD
SCHEMBL710222 1.00 KMT2A (0.60) KMT2AKDM4EGFERRXFP1ACMSD
SCHEMBL30690397 0.97 KMT2A (0.62) KMT2AKDM4EGFERRXFP1ACMSD
SCHEMBL33365 0.97 KMT2A (0.62) KMT2AKDM4EGFERRXFP1ACMSD
SCHEMBL30690398 0.97 KMT2A (0.62) KMT2AKDM4EGFERRXFP1ACMSD
SCHEMBL277684 0.95 KMT2A (0.60) KMT2AKDM4EGFERRXFP1ACMSD
Methane SCHEMBL19809365 0.95 KMT2A (0.60) KMT2AKDM4EGFERRXFP1ACMSD
Water SCHEMBL4330613 0.95 KMT2A (0.60) KMT2AKDM4EGFERRXFP1ACMSD
SCHEMBL4449185 0.95 KMT2A (0.60) KMT2AKDM4EGFERRXFP1ACMSD
Hydrochloric Acid SCHEMBL17491114 0.95 KMT2A (0.60) KMT2AKDM4EGFERRXFP1ACMSD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023149581-A1 SURFACE TREATMENT SOLUTION, AND METHOD FOR MANUFACTURING SURFACE-TREATED RESIN AND RESIN FILM LAMINATE 豊光社テクノロジーズ株式会社 2023-08-10 WO disclosed
US-5216173-A Curing agents for epoxy resins; polyimides HENKEL RESEARCH CORPORATION (US) 1993-06-01 US disclosed
EP-0484381-A1 N-CYANOIMIDES AND PROCESS FOR THEIR PREPARATION AND USES THEREOF HENKEL RESEARCH CORPORATION (US) 1992-05-13 EP disclosed
WO-1991001307-A2 N-CYANOIMIDES AND PROCESS FOR THEIR PREPARATION AND USES THEREOF HENKEL RESEARCH CORPORATION (US) 1991-02-07 WO disclosed