Known targets — ChEMBL curated mechanism
ABCC9ABL1ACEACHEACVR1ADORA1ADORA2AADORA2BADORA3ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3AGTR1ALOX5ATP4AATP4BBCRBTKCACNA1ACACNA1BCACNA1CCACNA1DCACNA1ECACNA1FCACNA1GCACNA1HCACNA1ICACNA1SCACNA2D1CACNA2D2CACNA2D3CACNA2D4CACNB1CACNB2CACNB3CACNB4CACNG1CACNG2CACNG3CACNG4CACNG5CACNG6CACNG7CACNG8CALCRLCFBCHRM1CHRM2CHRM3CHRM4CHRM5CHRNA1CHRNB1CHRNDCHRNECHRNGCRBNCUL4ACXCR1CXCR2DDB1DDCDHFRDPP4DRD2DRD3DRD4EGFRERBB2ERBB4ESR1ESR2FDPSFKBP1AFLT1FLT3FLT4GARTGHSRGRIA1GRIA2GRIA3GRIA4GRIK1GRIK2GRIK3GRIK4GRIK5GRIN2AGSK3AGSK3BHDAC1HDAC10HDAC11HDAC2HDAC3HDAC4HDAC5HDAC6HDAC7HDAC8HDAC9HRH1HTR1AHTR1BHTR1DHTR1EHTR1FHTR2AHTR2BHTR2CHTR3AHTR3BHTR3CHTR3DHTR3EHTR4HTR5AHTR6HTR7IDH1IDH2IMPA1ITGA2BITGB3JAK1JAK2JAK3KCNJ11KCNK3KCNK9KDRKITMEN1METMMP1MMP13MMP7MMP8NANOD2NS5bODC1OPG057OPRD1OPRK1OPRM1PPARP1PARP2PDE3APDE3BPDE4APDE4BPDE4CPDE4DPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PKLRPPARDPPATPTGS1PTGS2RBX1ROCK1ROCK2RRM1RRM2RRM2BSCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASCNN1ASCNN1BSCNN1GSIGMAR1SLC10A2SLC5A2SLC6A2SLC6A3SLC6A4SLC9A3SYKTACR1THRATHRBTOP1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYK2TYMSVDRampCblablaT-3blaT-4blaT-5blaT-6blaUOE-1dacAdacBdacCfolAfolPftsIgyrAgyrBileSmecAmrcAmrcBmrdAparCparEpbp2pbp4pbpApbpFrplArplBrplCrplDrplErplFrplIrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmE2rpmFrpmGrpmG1rpmG2rpmG3rpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUthyAykgMykgO
The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DHFR known ✓ | P00374 | 1/20 | 0.54 |
| ▸ | MEN1 known ✓ | O00255 | 1/20 | 0.47 |
| ▸ | SLC6A2 known ✓ | P23975 | 1/20 | 0.47 |
| ▸ | SLC6A4 known ✓ | P31645 | 1/20 | 0.47 |
| ▸ | DRD3 known ✓ | P35462 | 1/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.60 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.60 |
| ▸ | GFER | P55789 | 1/20 | 0.60 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.60 |
| ▸ | ACMSD | Q8TDX5 | 4/20 | 0.54 |
| ▸ | MCL1 | Q07820 | 4/20 | 0.54 |
| ▸ | HNF4A | P41235 | 2/20 | 0.54 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.50 |
| ▸ | CFD | P00746 | 1/20 | 0.50 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.50 |
| ▸ | LCK | P06239 | 1/20 | 0.50 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.48 |
| ▸ | CDC25A | P30304 | 1/20 | 0.48 |
| ▸ | CDC25B | P30305 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30690397 | 0.97 | KMT2A (0.62) | KMT2AKDM4EGFERRXFP1ACMSD | |
| SCHEMBL33365 | 0.97 | KMT2A (0.62) | KMT2AKDM4EGFERRXFP1ACMSD | |
| SCHEMBL30690398 | 0.97 | KMT2A (0.62) | KMT2AKDM4EGFERRXFP1ACMSD | |
| SCHEMBL4449185 | 0.95 | KMT2A (0.60) | KMT2AKDM4EGFERRXFP1ACMSD | |
| Hydrochloric Acid SCHEMBL893804 | 0.95 | KMT2A (0.60) | KMT2AKDM4EGFERRXFP1ACMSD | |
| Hydrochloric Acid SCHEMBL17491114 | 0.95 | KMT2A (0.60) | KMT2AKDM4EGFERRXFP1ACMSD | |
| SCHEMBL277684 | 0.95 | KMT2A (0.60) | KMT2AKDM4EGFERRXFP1ACMSD | |
| Methane SCHEMBL19809365 | 0.95 | KMT2A (0.60) | KMT2AKDM4EGFERRXFP1ACMSD | |
| Benzene SCHEMBL3623695 | 0.95 | KMT2A (0.60) | KMT2AKDM4EGFERRXFP1ACMSD | |
| SCHEMBL9550353 | 0.95 | KMT2A (0.60) | KMT2AKDM4EGFERRXFP1ACMSD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-10330615-A | — | — | None | — | — | JP | disclosed |
| WO-2020130261-A1 | CROSSLINKING AGENT COMPOUND, PHOTOSENSITIVE COMPOSITION INCLUDING SAME, AND PHOTOSENSITIVE MATERIAL USING SAME | 주식회사 엘지화학 | 2020-06-25 | — | — | WO | disclosed |
| EP-3275940-B1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2019-12-18 | — | — | EP | disclosed |
| US-10257938-B2 | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board | JX NIPPON MINING & METALS CORPORATION (JP) | 2019-04-09 | — | — | US | disclosed |
| US-20180279482-A1 | SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD | JX NIPPON MINING & METALS CORPORATION (JP) | 2018-09-27 | — | — | US | disclosed |
| US-9955583-B2 | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board | JX NIPPON MINING & METALS CORPORATION (JP) | 2018-04-24 | — | — | US | disclosed |
| US-20160183380-A1 | SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD | JX NIPPON MINING & METALS CORPORATION (JP) | 2016-06-23 | — | — | US | disclosed |
| US-20160157356-A1 | SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD | JX NIPPON MINING & METALS CORPORATION (JP) | 2016-06-02 | — | — | US | disclosed |
| EP-3026144-A1 | SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD | JX Nippon Mining & Metals Corp. (JP) | 2016-06-01 | — | — | EP | disclosed |
| EP-3026145-A1 | TREATED SURFACE COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED CIRCUIT BOARD, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD | JX Nippon Mining & Metals Corporation (JP) | 2016-06-01 | — | — | EP | disclosed |
| US-6706841-B2 | RECURRING UNITS OF AN AROMATIC TETRACARBOXYLIC ACID, AN AROMATIC AMINE AND AMINO FUNCTIONALIZED POLYSILOXANE, A (METH) ACRYLIC COMPOUND, AND A POLYMERIZATION INITIATOR HAS FLUIDITY AT 25 DEGREES C | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-03-16 | — | — | US | disclosed |
| US-6605366-B2 | Metal film/aromatic polymide film laminate | UBE INDUSTRIES, LTD. (JP) | 2003-08-12 | — | — | US | disclosed |
| US-20020188069-A1 | Solventless polyimide silicone resin compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-12-12 | — | — | US | disclosed |
| EP-1258509-A1 | Solventless polyimide silicone resin compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-11-20 | — | — | EP | disclosed |
| US-6440576-B1 | Metal plated aromatic polyimide film | UBE INDUSTRIES, LTD. (JP) | 2002-08-27 | — | — | US | disclosed |
| US-20010010860-A1 | Metal film/aromatic polymide film laminate | UBE INDUSTRIES, LTD. | 2001-08-02 | — | — | US | disclosed |
| US-6129982-A | HIGH HEAT RESISTANCE, LOW ELECTROCONDUCTIVITY, AND HIGH BONDING STRENGTH, USED FOR ELECTRONICS; ALUMINUM OR ALUMINUM OXIDE LAYERS ON BOTH SIDE OF AROMATIC POLYIMIDE FILM | UBE INDUSTRIES, LTD. (JP) | 2000-10-10 | — | — | US | disclosed |
| EP-0981268-A1 | Circuit board with an electronic component mounted thereon and multi-layer board | NITTO DENKO CORPORATION (JP) | 2000-02-23 | — | — | EP | disclosed |
| EP-0919593-A1 | Aromatic polyimide film having improved adhesion | UBE INDUSTRIES, LTD. (JP) | 1999-06-02 | — | — | EP | disclosed |
| JP-H10330615-A | SOLUTION OF AROMATIC POLYAMIC ACID | UBE IND LTD | 1998-12-15 | — | — | JP | disclosed |