SCHEMBL9609347

SCHEMBL9609347

O=S(=O)(O)C(F)(F)C(F)(F)S(=O)(=O)N1CCCCC1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.41
CA2 P00918 2/20 0.41
POLB P06746 1/20 0.41
KMT2A Q03164 4/20 0.39
TSHR P16473 4/20 0.39
ALDH1A1 P00352 3/20 0.35
MEN1 O00255 2/20 0.35
HPGD P15428 1/20 0.35
USP2 O75604 1/20 0.34
KDM4E B2RXH2 1/20 0.34
ATM Q13315 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
CYP3A4 P08684 1/20 0.32
CYP2C9 P11712 1/20 0.32
CYP2C19 P33261 1/20 0.32
PDK1 Q15118 2/20 0.31
PDK2 Q15119 2/20 0.31
PDK3 Q15120 2/20 0.31
PDK4 Q16654 2/20 0.31
ABCC9 O60706 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9609348 0.98 CA1 (0.37) CA1CA2POLBKMT2ATSHR
SCHEMBL21587515 0.88 CA1 (0.38) CA1CA2POLBKMT2ATSHR
SCHEMBL190593 0.88 CA1 (0.38) CA1CA2POLBKMT2ATSHR
SCHEMBL10146446 0.88 CA1 (0.38) CA1CA2POLBKMT2ATSHR
SCHEMBL2759961 0.88 CA1 (0.38) CA1CA2POLBKMT2ATSHR
SCHEMBL9986725 0.86 CA1 (0.37) CA1CA2POLBKMT2ATSHR
SCHEMBL16519706 0.83 CA1 (0.38) CA1CA2POLBKMT2ATSHR
SCHEMBL15925430 0.83 CA1 (0.38) CA1CA2POLBKMT2ATSHR
SCHEMBL9609359 0.83 CA1 (0.41) CA1CA2POLBKMT2ATSHR
SCHEMBL16519732 0.81 CA1 (0.34) CA1CA2POLBKMT2ATSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230280652-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING MONOMERIC COMPOUND JSR CORPORATION (JP) 2023-09-07 US disclosed
US-11709428-B2 Radiation-sensitive resin composition, method for forming pattern, and method for producing monomeric compound JSR CORPORATION (JP) 2023-07-25 US disclosed
EP-1795962-B1 Positive resist composition and pattern for forming method using the same FUJIFILM CORP (JP) 2014-02-12 EP disclosed
US-20120135348-A1 ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2012-05-31 US disclosed