SCHEMBL962547

SCHEMBL962547

O=C1C=CC(=O)N1CC1CO1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 2/20 0.54
SMN1; SMN2 Q16637 2/20 0.54
HBB P68871 1/20 0.54
DHFR P00374 1/20 0.43
MGLL Q99685 8/20 0.41
FAAH O00519 4/20 0.41
MAPT P10636 3/20 0.41
ALDH1A1 P00352 2/20 0.41
LMNA P02545 2/20 0.41
NPSR1 Q6W5P4 2/20 0.41
GMNN O75496 1/20 0.41
THPO P40225 1/20 0.41
BLM P54132 1/20 0.41
PMP22 Q01453 1/20 0.41
HSP90AA1 P07900 1/20 0.39
TLR9 Q9NR96 1/20 0.39
PKM P14618 1/20 0.39
HPGD P15428 1/20 0.39
XBP1 P17861 1/20 0.39
MAPK1 P28482 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21119007 0.80 TP53 (0.64) TP53SMN1; SMN2HBBDHFRMAPT
SCHEMBL21119006 0.80 TP53 (0.64) TP53SMN1; SMN2HBBDHFRMAPT
SCHEMBL17983096 0.78 MGLL (0.48) TP53SMN1; SMN2HBBMGLLFAAH
SCHEMBL23207578 0.78 POLB (0.34) TP53SMN1; SMN2HBBMGLLFAAH
SCHEMBL9734733 0.78 CYP1A2 (0.61) MAPTALDH1A1MAPK1RECQLRAB9A
SCHEMBL31482874 0.75 TSHR (0.42) TP53SMN1; SMN2HBBMGLLFAAH
SCHEMBL17983186 0.75 MGLL (0.56) TP53SMN1; SMN2HBBMGLLFAAH
SCHEMBL31438434 0.75 CYP1A2 (0.40) TP53SMN1; SMN2MGLLFAAHMAPT
SCHEMBL6454276 0.74 TP53 (0.56) TP53SMN1; SMN2HBBDHFRMAPT
SCHEMBL964091 0.74 SMN1; SMN2 (0.56) TP53SMN1; SMN2HBBDHFRMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 152 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160237186-A1 METHOD FOR PRODUCING POLYDIENES AND POLYDIENE COPOLYMERS WITH REDUCED COLD FLOW BRIDGESTONE CORPORATION (JP) 2016-08-18 US claimed
EP-3375799-B1 METHOD FOR PRODUCING SEMI-IPN COMPOSITE AND METHOD FOR PRODUCING MOISTURE-PERMEABLE FILM DAINIPPON INK & CHEMICALS (JP) 2025-09-03 EP disclosed
US-20250215216-A1 THERMOPLASTIC POLYESTER RESIN COMPOSITION, METHOD FOR PRODUCING THERMOPLASTIC POLYESTER RESIN COMPOSITION, AND MOLDED ARTICLE TORAY INDUSTRIES, INC. (JP) 2025-07-03 US disclosed
WO-2025079453-A1 INJECTION MOLDED BODY, METHOD FOR PRODUCING INJECTION MOLDED BODY, AND MACHINE キヤノン株式会社 2025-04-17 WO disclosed
WO-2025037599-A1 RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, PELLETS, MOLDED BODY, INJECTION MOLDED BODY, AND APPARATUS キヤノン株式会社 2025-02-20 WO disclosed
EP-4471086-A1 THERMOPLASTIC POLYESTER RESIN COMPOSITION, METHOD FOR PRODUCING THERMOPLASTIC POLYESTER RESIN COMPOSITION, AND MOLDED ARTICLE Toray Industries, Inc. (JP) 2024-12-04 EP disclosed
CN-118956419-A Liquid crystal aligning agent, liquid crystal alignment film and liquid crystal element JSR株式会社 2024-11-15 CN disclosed
CN-115362215-B Aqueous resin composition and coating agent DIC株式会社 2024-10-18 CN disclosed
CN-118530734-A Liquid crystal aligning agent, liquid crystal alignment film, liquid crystal element, polymer, and compound JSR株式会社 2024-08-23 CN disclosed
EP-4098691-B1 THERMOPLASTIC POLYESTER RESIN COMPOSITION AND MOLDED ARTICLE TORAY INDUSTRIES (JP) 2024-08-21 EP disclosed
US-20070260019-A1 Resin composition and molded article, film and fiber each comprising the same TORAY INDUSTRIES, INC. (JP) 2007-11-08 US disclosed
US-7268190-B2 Resin composition comprising polylactic acid and polyacetal and a molded article, film, and fiber each comprising the same TORAY INDUSTRIES, INC. (JP) 2007-09-11 US disclosed
CN-1307259-C Resin composition and molding, film and fiber each comprising the same TORAY INDUSTRIES (JP) 2007-03-28 CN disclosed
US-20060276617-A1 Aliphatic polyester resin composition, preparation method therefor, and molded article and foamed article produced from the resin composition UNITIKA LTD. (JP) 2006-12-07 US disclosed
EP-1640406-A1 ALIPHATIC POLYESTER RESIN COMPOSITION, METHOD FOR PRODUCTION THEREOF, MOLDED ARTICLE AND FOAMED ARTICLE COMPRISING THE RESIN COMPOSITION UNITIKA LTD. (JP) 2006-03-29 EP disclosed
CN-1564848-A Resin composition and molding, film and fiber each comprising the same TORAY INDUSTRIES (JP) 2005-01-12 CN disclosed
US-20040242803-A1 Resin composition and molded article, film, and fiber each comprising the same TORAY INDUSTRIES, INC. (JP) 2004-12-02 US disclosed
EP-1445282-A1 RESIN COMPOSITION AND MOLDED ARTICLE FILM AND FIBER EACH COMPRISING THE SAME TORAY INDUSTRIES, INC. (JP) 2004-08-11 EP disclosed
EP-0071571-B1 PHOTOPOLYMERISATION PROCESS CIBA-GEIGY AG (CH) 1985-09-04 EP disclosed
EP-0071571-A1 Photopolymerisation process CIBA-GEIGY AG (CH) 1983-02-09 EP disclosed