SCHEMBL9633402

SCHEMBL9633402

C=CC(=O)OCCOc1cccc(OCCOC(=O)C=C)c1

nearest known ligand 0.78

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.78
TSHR P16473 7/20 0.50
ALDH1A1 P00352 5/20 0.50
TP53 P04637 2/20 0.50
HIF1A Q16665 2/20 0.50
HSD17B10 Q99714 1/20 0.50
CYP3A4 P08684 1/20 0.46
L3MBTL1 Q9Y468 4/20 0.45
TDP1 Q9NUW8 3/20 0.45
KMT2A Q03164 2/20 0.45
KDM4E B2RXH2 1/20 0.45
MEN1 O00255 1/20 0.45
ATM Q13315 1/20 0.45
LMNA P02545 2/20 0.43
MAPK1 P28482 2/20 0.43
MAPT P10636 1/20 0.43
MTNR1A P48039 1/20 0.42
MTNR1B P49286 1/20 0.42
HPGD P15428 2/20 0.42
FFAR1 O14842 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19456745 0.95 THRB (0.71) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL19456766 0.95 THRB (0.71) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL17033928 0.95 THRB (0.71) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL17033925 0.95 THRB (0.71) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL13368727 0.94 THRB (0.69) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL19456800 0.94 THRB (0.69) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL24191463 0.92 THRB (0.68) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL24565141 0.92 THRB (0.68) THRBTSHRALDH1A1L3MBTL1TDP1
SCHEMBL19456748 0.92 THRB (0.66) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL8928357 0.92 THRB (0.66) THRBTSHRALDH1A1TP53HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5122436-A Homogeneous blend of polyimidesiloxane and unsaturated monomer EASTMAN KODAK COMPANY (US) 1992-06-16 US claimed
US-5098814-A Integrated circuit chips of laminates of flexible metal strips and photoresists of polyimidesiloxane copolymers EASTMAN KODAK COMPANY (US) 1992-03-24 US claimed
CN-120192229-A Tetrafunctional fluorenyl acrylate resin monomer, and preparation method and application thereof 上海化工研究院有限公司 2025-06-24 CN disclosed
US-20220091503-A1 COMPOSITION FOR FORMING PATTERN, CURED FILM, LAMINATE, PATTERN PRODUCING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT FUJIFILM CORPORATION (JP) 2022-03-24 US disclosed
US-20220009153-A1 COMPOSITION FOR FORMING PATTERN, KIT, CURED FILM, LAMINATE, PATTERN PRODUCING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT FUJIFILM CORPORATION (JP) 2022-01-13 US disclosed
US-20220002450-A1 COMPOSITION FOR FORMING PATTERN, KIT, PATTERN PRODUCING METHOD, PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT FUJIFILM CORPORATION (JP) 2022-01-06 US disclosed
US-20210388134-A1 CURABLE COMPOSITION FOR IMPRINTING, KIT, PATTERN PRODUCING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT FUJIFILM CORPORATION (JP) 2021-12-16 US disclosed
US-20210232049-A1 CURABLE COMPOSITION FOR IMPRINTING, METHOD FOR PRODUCING CURABLE COMPOSITION FOR IMPRINTING, CURED PRODUCT, PATTERN PRODUCING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT FUJIFILM CORPORATION (JP) 2021-07-29 US disclosed
US-20200363718-A1 KIT, COMPOSITION FOR FORMING UNDERLAYER FILM FOR IMPRINTING, LAMINATE, AND PRODUCTION METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2020-11-19 US disclosed
US-20200216709-A1 COMPOSITION FOR FORMING UNDERLAYER FILM FOR IMPRINTS, KIT, CURABLE COMPOSITION FOR IMPRINTS, LAMINATE, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING CURED PRODUCT PATTERN, AND METHOD FOR PRODUCING CIRCUIT BOARD FUJIFILM CORPORATION (JP) 2020-07-09 US disclosed
US-20200157267-A1 CURABLE COMPOSITION FOR IMPRINTING, CURED PRODUCT, PATTERN FORMING METHOD, LITHOGRAPHY METHOD, PATTERN, MASK FOR LITHOGRAPHY, AND POLYMERIZABLE COMPOSITION FOR IMPRINTING FUJIFILM CORPORATION (JP) 2020-05-21 US disclosed
WO-2017176011-A1 COMPOUND FOR ENCAPSULATING ORGANIC ELECTROLUMINESCENT DEVICE, COMPOSITION, AND ENCAPSULATED DEVICE COMPRISING SAME 덕산네오룩스 주식회사 2017-10-12 WO disclosed
US-5122436-A Homogeneous blend of polyimidesiloxane and unsaturated monomer EASTMAN KODAK COMPANY (US) 1992-06-16 US disclosed
US-5098814-A Integrated circuit chips of laminates of flexible metal strips and photoresists of polyimidesiloxane copolymers EASTMAN KODAK COMPANY (US) 1992-03-24 US disclosed